|
CENELEC EN 60825-1 |
Safety of laser products - Part 1: Equipment classification and requirements |
|
CENELEC EN 60384-14 |
Fixed capacitors for use in electronic equipment Part 14: Sectional specification - Fixed capacitors for electromagnetic interference suppression and connection to the supply mains-IEC 60384-14: 2005; Supersedes EN 132400: 1994 |
|
CENELEC EN 133200 |
Sectional Specification: Passive Filter Units for Electromagnetic Interference Suppression (Filters for Which Safety Tests are Required) |
|
CENELEC EN 60939-1 |
Passive filter units for electrom agnetic interference suppression Part 1: Generic specification-IEC 60939-1:2005; Supersedes EN 133000: 1997 |
|
CENELEC EN 60617-13 |
Graphical Symbols for Diagrams Part 13: Analogue Elements (IEC 617-13 : 1993) |
|
CENELEC EN 50419 |
Marking of electrical and electronic equipment in accordance with Article 11(2) of Directive 2002/96/EC (WEEE) |
|
CENELEC EN 60939-2 |
Passive filter units for electromagnetic interference suppression Part 2: Sectional specification: Passive filter units for which safety tests are appropriate - Test methods and general requirements-IEC 60939-2:2005; Supersedes EN 133200: 1999 |
|
CENELEC EN 61984 |
Connectors - Safety Requirements and Tests-IEC 61984:2001 |
|
CENELEC EN 60617-6 |
Graphical Symbols for Diagrams Part 6: Production and Conversion of Electrical Energy-IEC 617-6: 1996 |
|
CENELEC EN 60738-1 |
Thermistors - Directly heated positive temperature coefficient Part 1: Generic specification-IEC 60738-1:2006 |
|
CENELEC EN 60939-2-1 |
Complete filter units for radio interference suppression Part 2-1: Blank detail specification Passive filter units for electromagnetic interference suppression Filters for which safety tests are required (assessment level D/DZ)-IEC 60939-2-1:2004; Supersedes EN 133201:1998 |
|
CENELEC EN 60384-1 |
Fixed Capacitors for Use in Electronic Equipment Part 1: Generic Specification-IEC 60384-1:1999, Modified |
|
CENELEC EN 60068-2-21 |
Environmental Testing - Part 2-21: Tests - Test U: Robustness of Terminations and Integral Mounting Devices-IEC 60068-2-21:2006 |
|
CENELEC EN 61643-331 |
Components for low-voltage surge protective devices Part 331: Specification for metal oxide varistors (MOV)-IEC 61643-331: 2003 |
|
CENELEC EN 60939-2-2 |
Complete filter units for radio interference suppression Part 2-2: Blank detail specification Passive filter units for electromagnetic interference suppression Filters for which safety tests are required (safety tests only)-IEC 60939-2-2:2004; Supersedes EN 133221:1998 |
|
CENELEC EN 60617-4 |
Graphical Symbols for Diagrams Part 4: Basic Passive Components (IEC 617-4 : 1996) |
|
CENELEC EN 133000 |
Generic Specification: Passive Filter Units for Electromagnetic Interference Suppression |
|
CENELEC EN 60617-5 |
Graphical Symbols for Diagrams Part 5: Semiconductors and Electron Tubes-IEC 617-5: 1996 |
|
CENELEC EN 60747-5-2 |
Discrete Semiconductor Devices and Integrated Circuits - Part 5-2: Optoelectronic Devices - Essential Ratings and Characteristics-Includes Amendment A1:2002; IEC 61747-5-2: 1997 + A1:2002 |
|
CENELEC EN 60068-2-42 |
Environmental testing Part 2-42: Tests Test Kc: Sulphur dioxide test for contacts and connections-IEC 60068-2-42: 2003 |
|
CENELEC EN 60352-2 |
Solderless Connections Part 2: Crimped Connections - General Requirements, Test Methods and Practical Guidance-IEC 60352-2: 2006 |
|
CENELEC EN 60512-2-1 |
Connectors for Electronic Equipment Tests and Measurements Part 2-1: Electrical Continuity and Contact Resistance Tests Test 2a: Contact Resistance Millivolt Level Method-IEC 60512-2-1: 2002 |
|
CENELEC EN 61747-3 |
Liquid crystal display devices Part 3: Liquid crystal display (LCD) cells - Sectional specification-IEC 61747-3:2006 |
|
CENELEC EN 61071-1 |
Power Electronic Capacitors Part 1: General-IEC 1071-1: 1991, Modified |
|
CENELEC EN 61587-3 |
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 Part 3: Electromagnetic shielding performance tests for cabinets, racks and subracks |
|
CEN EN ISO 11146-1 |
Lasers and laser-related equipment - Test methods for laser beam widths, divergence angles and beam propagation ratios - Part 1: Stigmatic and simple astigmatic beams-ISO 11146-1:2005 |
|
CENELEC EN 60252-1 |
A.C. Motor Capacitors Part 1: General - Performance, Testing and Rating - Safety Requirements - Guide for Installation and Operation-IEC 60252-1:2001 |
|
CENELEC EN 60352-5/A1 |
Solderless connections Part 5: Press-in connections General requirements, test methods and practical guidance-IEC 60352-5:2001/A1:2003; Ratified European Text |
|
CENELEC EN 61076-2-103 |
Connectors for electronic equipment Part 2-103: Circular connectors Detail specification for a range of multipole connectors (type XLR)-IEC 61076-2-103:2004 |
|
CENELEC EN 61189-2 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2: Test methods for materials for interconnection structures |
|
CENELEC EN 60146-2 |
Semiconductors convertors Part 2: Self-commutated semiconductor converters including direct d.c. converters-IEC 60146-2: 1999 |
|
CENELEC EN 60512-1 |
Connectors for Electronic Equipment - Tests and Measures Part 1: General-IEC 60512-1:2001 |
|
CENELEC EN 60512-6-4 |
Connectors for Electronic Equipment - Tests and Measurements - Part 6-4: Dynamic Stress Test 6d: Vibration (Sinusoidal)-IEC 60512-6-4:2002 |
|
CENELEC EN 60747-5-3 |
Discrete semiconductor devices and integrated circuits Part 5-3: Optoelectronic devices Measuring methods-Includes amendment A1:2002; IEC 60747-5-3:1997 + A1:2002 |
|
CEN EN ISO 13694 |
Optics and Optical Instruments - Lasers and Laser-Related Equipment - Test Methods for Laser Beam Power (Energy) Density Distribution-ISO 13694:2000 |
|
CEN EN 12254 |
Screens for Laser Working Places - Safety Requirements and Testing-Includes Amendment A1:2002 |
|
CENELEC EN 175301-801 |
Detail Specification: High Density Rectangular Connectors, Round Removable Crimp Contacts |
|
CENELEC EN 60068-2-43 |
Environmental testing Part 2-43: Tests Test Kd: Hydrogen sulphide test for contacts and connections-IEC 60068-2-43: 2003 |
|
CENELEC EN 60068-2-58 |
Environmental testing Part 2-58: Tests Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)-IEC 60068-2-58:2004 |
|
CENELEC EN 60352-7 |
(FAULTY STANDARD) Solderless Connections - Part 7: Spring Clamp Connections - General Requirements, Test Methods and Practical Guidance-IEC 60352-7:2002 |
|
CENELEC EN 60512-6-5 |
Electromechanical Components for Electronic Equipment - Basic Testing Procedures and Measuring Methods Part 6: Dynamic Stress Tests Section 5: Test 6e: Random Vibration-IEC 60512-6-5:1997, Modified |
|
CENELEC EN 137000 |
Generic Specification Fixed Aluminium Electrolytic a.c. Capacitors with Non- Solid Electrolyte for Use with Motors |
|
CENELEC EN 60512-1-1 |
Connectors for Electronic Equipment - Tests and Measurements Part 1-1: General Examination - Test 1a: Visual Examination-IEC 60512-1-1:2002 |
|
CENELEC EN 61076-1 |
Connectors for electronic equipment - Product requirements Part 1: Generic specification-IEC 61076-1:2006 |
|
CEN EN 62047-3 |
Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing |
|
CENELEC EN 62132-1 |
Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz Part 1: General conditions and definitions-Incorporating corrigendum November 2006 |
|
CEN CLC/TR 50448 |
Guide to levels of competence required in laser safety |
|
CENELEC EN 60512-1-4 |
Electromechanical Components for Electronic Equipment Basic Testing Procedures and Measuring Methods - Part 1: General - Section 4: Test 1d: Contact Protection Effectiveness (Scoop-Proof)-IEC 60512-1-4: 1997 |
|
CENELEC EN 60825-4 |
Safety of laser products - Part 4: Laser guards-IEC 60825-4:2006 |
|
CENELEC EN 62326-1 |
Printed Boards Part 1: Generic Specification-IEC 62326-1: 2002 |
|
CEN EN ISO 11810-1 |
Lasers and laser-related equipment - Test method and classification for the laser resistance of surgical drapes and/or patient protective covers - Part 1: Primary ignition and penetration-ISO 11810-1:2005; Supersedes EN ISO 11810:2002 |
|
CENELEC EN 168100+ A1 AND A2 |
Sectional Specification: Quartz Crystal Units (Capability Approval) (Includes Amendments A1 and A2 : 1993) |
|
CEN EN 31253 |
Lasers and Laser-Related Equipment - Laser Device - Mechanical Interfaces (ISO 11253 : 1993) |
|
CENELEC EN 60384-14-1 |
Fixed capacitors for use in electronic equipment Part 14-1: Blank detail specification - Fixed capacitors for electromagnetic interference suppression and connection to the supply mains - Assessment level D-IEC 60384-14-1: 2005; Supersedes EN 132401: 1994 |
|
CENELEC EN 60384-25 |
Fixed capacitors for use in electronic equipment Part 25: Sectional specification - Surface mount fixed aluminium electrolytic capacitors with conductive polymer solid electrolyte-IEC 60384-25:2006 |
|
CENELEC EN 60512-14-4 |
Connectors for electronic equipment - Tests and measurements Part 14-4: Sealing tests - Test 14d: Immersion - Waterproof-IEC 60512-14-4:2006 |
|
CENELEC EN 60512-15-8 |
Electomechanical Components for Electronic Equipment - Basic Testing Procedures and Measuring Methods - Part 15: Mechanical Tests on Contacts and Terminations - Section 8: Test 15h - Contact Retention System Resistance to Tool Application-IEC 512-15-8: 1995 |
|
CENELEC EN 60512-16-20 |
Electromechanical Components for Electronic Equipment - Basic Testing Procedures and Measuring Methods - Part 16: Mechanical Tests on Contacts and Terminations Section 20: Test 16t: Mechanical Strength (Wired Termination of Solderless Connections)-IEC 512-16-20: 1996 |
|
CENELEC EN 60512-6-3 |
Connectors for Electronic Equipment - Tests and Measurements Part 6-3: Dynamic Stress Tests - Test 6c: Shock-IEC 60512-6-3:2002 |
|
CENELEC EN 60603-7-1 |
Connectors for Electronic Equipment Part 7-1: Detail Specification for 8-Way, Shielded Free and Fixed Connectors with Common Mating Features, with Assessed Quality-IEC 60603-7-1: 2002 |
|
CENELEC EN 60749-26 |
Semiconductor devices - Mechanical and climatic test methods Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)-IEC 60749-26:2006 |
|
CEN EN 60749-30 |
Semiconductor devices - Mechanical and climatic test methods Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing-IEC 60749-30: 2005 |
|
CENELEC EN 60831-2 |
Shunt Power Capacitors of the Self-Healing Type for a.c. Systems Having a Rated Voltage up to and Including 1 kV Part 2: Ageing Test, Self-Healing Test and Destruction Test (IEC 831-2 : 1995) |
|
CENELEC EN 61076-4-101 |
Connectors for Electronic Equipment Part 4-101: Printed Board Connectors with Assessed Quality - Detail Specification for Two-Part Connector Modules, Having a Basic Grid of 2,0 mm for Printed Boards and Backplanes in Accordance with IEC 60917-IEC 61076-4-101:2001 |
|
CENELEC EN 61249-2-7 |
Materials for Printed Boards and Other Interconnecting Structures Part 2-7: Reinforced Base Materials Clad and Unclad - Epoxide Woven E-Glass Laminated Sheet of Defined Flammability (Vertical Burning Test), Copper-Clad-Incorporates Corrigendum September 2005; IEC 61249-2-7: 2002; Supersedes EN 60249-2-5:1994 & EN 60249-2-12:1994 and their Amendments |
|
CENELEC EN 61709 |
Electronic Components - Reliability - Reference Conditions for Failure Rates and Stress Models for Conversion-IEC 61709:1996 |
|
CENELEC EN 61747-2-1 |
Liquid Crystal and Solid-State Display Devices - Part 2-1: Passive Matrix Monochrome LCD Modules - Blank Detail Specification-IEC 61747-2-1:1998 |
|
CENELEC EN 61747-3-1 |
Liquid crystal display devices Part 3-1: Liquid crystal display (LCD) cells - Blank detail specification |
|
CENELEC EN 61747-5 |
Liquid Crystal and Solid-State Display Devices Part 5: Environmental, Endurance and Mechanical Test Methods-IEC 61747-5:1998 |
|
CENELEC EN 61966-5 |
Multimedia Systems and Equipment - Colour Measurement and Management Part 5: Equipment Using Plasma Display Panels-IEC 61966-5: 2000 |
|
CENELEC EN 61967-1 |
Integrated Circuits - Measurement of Electromagnetic Emissions, 150 kHZ to 1 GHz Part 1: General Conditions and Definitions-IEC 61967-1: 2002 |
|
CEN EN ISO 11149 |
Optics and Optical Instruments - Lasers and Laser-Related Equipment - Fibre Optic Connectors for Non-Telecommunication Laser Applications-ISO 11149: 1997 |
|
CEN EN ISO 11553-1 |
Safety of machinery - Laser processing machines - Part 1: General safety requirements-ISO 11553-1:2005; Supersedes EN 12626:1997 |
|
CEN EN ISO 11670 |
Lasers and laser-related equipment - Test methods for laser beam parameters - Beam positional stability-ISO 11670: 2003 |
|
CEN EN ISO 14880-2 |
Optics and photonics - Microlens arrays - Part 2: Test methods for wavefront aberrations |
|
CEN EN ISO 14881 |
Integrated optics - Interfaces - Parameters relevant to coupling properties-ISO 14881:2001 |
|
CEN EN ISO 15367-1 |
Lasers and laser-related equipment - Test methods for determination of the shape of a laser beam wavefront - Part 1: Terminology and fundamental aspects-ISO 15367-1: 2003 |
|
CENELEC EN 137100 |
Sectional Specification: Fixed Aluminium Electrolytic a.c. Capacitors with Non- Solid Electrolyte for Motor Starter Applications Qualification Approval |
|
CEN EN 28877 |
Information Technology - Telecommunications and Information Exchange Between Systems - Interface Connector and Contact Assignments for ISDN Basic Access Interface Located at Reference Points S and T (ISO/IEC 8877 : 1992) |
|
CENELEC EN 60068-2-54 |
Environmental testing Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method-Supersedes HD 323.2.54 S1:1987; IEC 60068-2-54:2006 |
|
CENELEC EN 60068-2-69 |
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method |
|
CENELEC EN 60297-3-102 |
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series Part 3-102: Injector/extractor handle-IEC 60297-3-102:2004; Supersedes EN 60297-4:1995 + A1:1999 & EN 60297-5-101:2001 |
|
CENELEC EN 60384-14-2 |
Fixed capacitors for use in electronic equipment Part 14-2: Blank detail specification Fixed capacitors for electromagnetic interference suppression and connection to the supply mains Safety tests only-IEC 60384-14-2:2004; Partially supersedes EN 132421:1997 |
|
CENELEC EN 60444-9 |
Measurement of quartz crystal unit parameters - Part 9: Measurement of spurious resonances of piezoelectric crystal units |
|
CENELEC EN 60512-12-3 |
Connectors for electronic equipment - Tests and measurements Part 12-3: Soldering tests - Test 12c: Solderability, de-wetting-Incorporating corrigendum December 2006 |
|
CENELEC EN 60512-23-7 |
Connectors for electronic equipment Tests and measurements Part 23-7: Screening and filtering tests Test 23g: Effective transfer impedance of connectors-IEC 60512-23-7:2005 |
|
CENELEC EN 60512-6-1 |
Connectors for Electronic Equipment - Tests and Measurements Part 6-1: Dynamic Stress Tests - Test 6a: Acceleration, Steady State-IEC 60512-6-1: 2002 |
|
CENELEC EN 60603-7-7 |
Connectors for electronic equipment Part 7-7: Detail specification for 8-way, shielded, free and fixed connectors for data transmission with frequencies up to 600 MHz-IEC 60603-7-7:2006 |
|
CEN EN 60758 |
Synthetic quartz crystal Specifications and guide to the use-IEC 60758:2004 |
|
CENELEC EN 61086-3-1 |
Coatings for loaded printed wire boards (conformal coatings) Part 3-1: Specifications for individual materials - Coatings for general purpose (Class 1), high reliability (Class 2) and aerospace (Class 3) (IEC 61086-3-1:2004) |
|
CENELEC EN 61747-4 |
Liquid Crystal and Solid State Display Devices Part 4: Liquid Crystal Display Modules and Cells Essential Ratings and Characteristics-IEC 61747-4:1998 |
|
CEN EN 62384 |
DC or AC supplied electronic control gear for LED modules - Performance requirements |
|
CEN EN ISO 11146-2 |
Lasers and laser-related equipment - Test methods for laser beam widths, divergence angles and beam propagation ratios - Part 2: General astigmatic beams-ISO 11146-2:2005 |
|
CEN EN ISO 11254-1 |
Lasers and Laser-Related Equipment - Determination of Laser-Induced Damage Treshold of Optical Surfaces - Part 1: 1-on-1 Test-ISO 11254-1:2000 |
|
CEN EN ISO 14880-1 |
Microlens array - Part 1: Vocabulary-ISO 14880-1:2001, including Corrigendum 1:2004 |
|
CEN EN ISO 14880-3 |
Optics and phonotics - Microlens arrays - Part 3: Test methods for optical properties other than wavefront aberrations-ISO 14880-3: 2006 |
|
CEN EN ISO 14880-4 |
Optics and photonics - Microlens arrays - Part 4: Test methods for geometrical properties-ISO 14880-4:2006 |
|
CEN EN ISO 15902 |
Optics and photonics - Diffractive optics - Vocabulary-ISO 15902: 2004 |
|
CENELEC CLC/TS 61496-2 |
Safety of machinery Electro-sensitive protective equipment Part 2: Particular requirements for equipment using active opto-electronic protective devices (AOPD)-IEC 61496-2:1997 |
|
CEN EN 130801 |
Blank Detail Specification: Tantalum Surface Mounting Capacitors-Ratified European Text; Supersedes CECC 30 801: 1990 |
|
CENELEC EN 137101 |
Blank Detail Specification: Fixed Aluminium Electrolytic a.c. Capacitors with Non-Solid Electrolyte for Motor Starter Applications Qualifications Approval |
|
CENELEC EN 60249-2-3 |
Base Materials for Printed Circuits Part 2: Specifications Specification No.3: Epoxide Cellulose Paper Copper-Clad Laminated Sheet of Defined Flammability (Vertical Burning Test)-Includes Amendments A2:1994, A3:1995 and A4:2000; IEC 249-2-3:1987 + A1:1989 + A2:1993 + A3:1994 + A4:2000; Supersedes HD 313.2.3 S2:1990 |
|
CENELEC EN 60297-5-103 |
Mechanical Structures for Electronic Equipment - Dimensions of Mechanical Structures of the 482,6 mm (19 in) Series Part 5-103: Subracks and Associated Plug-in Units - Electrostatic Discharge Protection-IEC 60297-5-103:2001; Superseded by EN 60297-3-101:2004 |
|
CENELEC EN 60297-5-107 |
Mechanical Structures for Electronic Equipment - Dimensions of Mechanical Structures of the 482,6 mm (19 in) Series Part 5-107: Subracks and Associated Plug-In Units - Rear Mounted Plug-In Units-IEC 60297-5-107:2001; Superseded by EN 60297-3-101:2004 |
|
CENELEC EN 60512-2-2 |
Connectors for electronic equipment - Tests and measurements Part 2-2: Electrical continuity and contact resistance tests - Test 2b: Contact resistance - Specified test current method-IEC 60512-2-2: 2003 |
|
CENELEC EN 60512-4-1 |
Connectors for electronic equipment Tests and measurements Part 4-1: Voltage stress tests Test 4a: Voltage proof-IEC 60512-4-1:2003 |
|
CENELEC EN 60512-9-3 |
Connectors for electronic equipment - Tests and measurements Part 9-3: Endurance tests - Test 9c: Mechanical operation (engaging/separating) with electrical load-Incorporating corrigendum December 2006 |
|
CENELEC EN 60603-7 |
Connectors for Frequencies Below 3 MHz for Use with Printed Boards; Part 7: Detail Specification for Connectors, 8-Way, Including Fixed and Free Connectors with Common Mating Features, with Assessed Quality-Supersedes EN 60603-7:1993; IEC 603-7:1996 |
|
CENELEC EN 60825-12 |
Safety of laser products Part 12: Safety of free space optical communication systems used for transmission of information-IEC 60825-12:2004 |
|
CENELEC EN 60831-1 |
Shunt power capacitors of the self-healing type for a.c. system shaving a rated voltage up to and including 1 kV Part 1: General Performance, testing and rating Safety requirements Guide for installation and operation-Includes Amendment A1:2003; IEC 831-1:1996 + A1:2002 |
|
CENELEC EN 60891 |
Procedures for Temperature and Irradiance Corrections to Measured I- V Characteristics of Crystalline Silicon Photovoltaic Devices (IEC 891 : 1987 + A1 : 1992) |
|
CENELEC EN 61249-2-19 |
Materials for Printed Boards and Other Interconnecting Structures Part 2-19: Reinforced Base Materials, Clad and Unclad - Epoxide Cross-Plied Linear Fibreglass-Reinforced Laminated Sheets of Defined Flammability (Vertical Burning Test) Copper Clad-IEC 61249-2-19: 2001 |
|
CENELEC EN 61587-1 |
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 1: Climatic, mechanical tests and safety aspects for cabinets, racks, subracks and chassis |
|
CENELEC EN 61747-1/A1 |
Liquid Crystal and Solid-State Display Devices - Part 1: Generic Specification-IEC 61747-1: 1998/A1:2003; Amendment A1; Ratified European Text |
|
CENELEC EN 61967-5 |
Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 5: Measurement of conducted emissions Workbench Faraday Cage method-IEC 61967-5:2003 |
|
CENELEC EN 62132-4 |
Integrated circuits - Measurement of electromagnetic immunity 150 kHz to 1 GHz Part 4: Direct RF power injection method-IEC 62132-4: 2006 |
|
CEN EN ISO 11151-1 |
Lasers and Laser-Related Equipment - Standard Optical Components - Part 1: Components for the UV, Visible and Near-Infrared Spectral Ranges-ISO 11151-1: 2000 |
|
CEN EN ISO 11151-2 |
Lasers and Laser-Related Equipment - Standard Optical Components - Part 2: Components for the Infrared Spectral Range-ISO 11151-2: 2000 |
|
CEN EN ISO 11553-2 |
Safety of machinery - Laser processing machines - Part 2: Safety requirements for hand-held laser processing devices |
|
CEN EN ISO 11807-2 |
Integrated optics - Vocabulary - Part 2: Terms used in classification-ISO 11807-2:2001 |
|
CENELEC CLC/TR 50489 |
Smart tracker chips - Feasibility study on the inclusion of RFID in Electrical and Electronic Equipment for WEEE management |
|
CENELEC EN 140203 |
Blank Detail Specification: Fixed Power Resistors (Assessment Level H)-Supersedes CECC 40 203: 1981 |
|
CENELEC EN 141000 |
(Draft) Generic Specification: Potentiometers |
|
CENELEC EN 60062 |
Marking codes for resistors and capacitors-Incorporating corrigendum January 2007 |
|
CENELEC EN 60297-5-100 |
Mechanical Structures for Electronic Equipment - Dimensions of Mechanical Structures of the 482,6 mm (19 in) Series Part 5-100: Subracks and Associated Plug-In Units - Design Overview-IEC 60297-5-100:2001; Superseded by EN 60297-3-101:2004 |
|
CENELEC EN 60297-5-102 |
Mechanical Structures for Electronic Equipment - Dimensions of Mechanical Structures of the 482,6 mm (19 in) Series Part 5-102: Subracks and Associated Plug-In Units - Electromagetic Shielding Provision-IEC 60297-5-102:2001; Superseded by EN 60297-3-101:2004 |
|
CENELEC EN 60512-11-7 |
Connectors for electronic equipment - Tests and measurements Part 11- 7: Climatic tests - Test 11g: Flowing mixed gas corrosion test-IEC 60512-11-7:2003 |
|
CENELEC EN 60512-5-1 |
Connectors for Electronic Equipment - Tests and Measurements Part 5-1: Current-Carrying Capacity Tests - Tests 5a: Temperature Rise-IEC 60512-5-1:2002 |
|
CENELEC EN 60603-13 |
Connectors for Frequencies Below 3 MHz for Use with Printed Boards Part 13: Detail Specification for Two-Part Connectors of Assessed Quality, for Printed Boards for Basic Grid of 2,54 mm (0,1 in) with Free Connectors for Non-Accessible Insulation Displacement Terminations (ID)-IEC 60603-13:1995 |
|
CENELEC EN 60747-5-1 |
Discrete semiconductor devices and integrated circuits Part 5-1: Optoelectronic devices General-Includes amendments A1:2002 + A2:2002; IEC 60747-5-1:1997 + A1:2001 + A2:2002 |
|
CENELEC EN 61076-2-101 |
Connectors for electronic equipment Part 2-101: Circular connectors Detail specification for circular connectors M8 with screw- or snap-locking, M12 with screw-locking for low voltage applications-IEC 61076-2-101:2003 |
|
CENELEC EN 61076-2-102 |
Connectors for Electronic Equipment Part 2-102: Circular Connectors with Assessed Quality - Detail Specification for Plugs and Jacks for External Low Voltage Power Supply-IEC 61076-2-102: 2002 |
|
CENELEC EN 61340-5-2 |
Electrostatics - Part 5-2: Protection of Electronic Devices from Electrostatic Phenomena - User Guide-IEC 61340-5-2:1999 |
|
CENELEC EN 61643-311 |
Components for Low-Voltage Surge Protective Devices - Part 311: Specification for Gas Discharge Tubes (GDT)-IEC 61643-311: 2001 |
|
CENELEC EN 61643-341 |
Components for Low-Voltage Surge Protective Devices - Part 341: Specification for Thyristor Surge Suppressors (TSS)-IEC 61643-341: 2001 |
|
CEN EN ISO 11145 |
Optics and Optical Instruments - Lasers and Laser-Related Equipment - Vocabulary and Symbols-ISO 11145:2006 |
|
CEN EN ISO 11254-2 |
Lasers and Laser-Related Equipment - Determination of Laser-Induced Damage Threshold of Optical Surfaces - Part 2: S-on-1 Test-ISO 11254-2:2001 |
|
CEN EN ISO 11254-3 |
Lasers and laser-related equipment - Determination of laserinduced damage threshold of optical surfaces - Part 3: Assurance of laser power (energy) handling capabilities-ISO 11254-3:2006 |
|
CEN EN ISO 11554 |
Optics and photonics - Lasers and laser-related equipment - Test methods for laser beam power, energy and temporal characteristics-ISO 11554:2006 |
|
CEN EN ISO 11807-1 |
Integrated optics - Vocabulary - Part 1: Basic terms and symbols-ISO 11807-1:2001 |
|
CEN EN ISO 11990 |
Optics and optical instruments - Lasers and laser-related equipment - Determination of laser resistance of tracheal tube shafts-Corrected 07/02/2003; ISO 11990: 2003 |
|
CEN EN ISO 13697 |
Optics and photonics - Lasers and laser-related equipment - Test methods for specular reflectance and regular transmittance of optical laser components-ISO 13697:2006 |
|
CEN EN ISO 15367-2 |
Lasers and laser-related equipment - Test methods for determination of the shape of a laser beam wavefront - Part 2: Shack-Hartmann sensors-ISO 15367-2:2005 |
|
CENELEC HD 339 |
Series Capacitors for Power Systems |
|
CENELEC HD 613 S1 |
Direct-Current Potentiometers |
|
CENELEC CECC 96 701 |
Blank Detail Specification: Dual-in-line switches |
|
CENELEC EN 129200 |
Sectional Specification: Fixed Inductors with Ceramic or Ferrite Core Wound with Copper Wire for RF Circuits (Includes Amendment A1 : 1995) |
|
CENELEC EN 140200 |
Sectional Specification: Fixed Power Resistors-Includes Amendment A1: 2001; Supersedes CECC 40 200: 1981 |
|
CENELEC EN 140401-804 |
Detail specification: Fixed low power non wire-wound high stability surface mount (SMD) resistors - Rectangular - Stability classes 0,1; 0,25 |
|
CENELEC EN 150001 |
Blank Detail Specification: General Purpose Semiconductor Diodes |
|
CENELEC EN 196110 |
Sectional specification: Rotary switches - Capability approval-Ratified European Text |
|
CENELEC EN 50065-4-1 |
Signalling on Low-Voltage Electrical Installations in the Frequency Range 3 kHz to 148,5 kHz Part 4-1: Low Voltage Decoupling Filters - Generic Specification-Ratified European Text:01/08/2001 |
|
CENELEC EN 50065-4-2 |
Signalling on low voltage electrical installations in the frequency range 3 kHz to 148,5 kHz and 1,6 MHz to 30 MHz Part 4-2: Low voltage decoupling filters - Safety requirements-Includes Amendments A1:2003 and A2:2005 |
|
CENELEC EN 60143-2 |
Series Capacitors for Power Systems Part 2: Protective Equipment for Series Capacitor Banks (IEC 143-2:1994) |
|
CENELEC EN 60191-6-16 |
Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA |
|
CENELEC EN 60191-6-5 |
Mechanical Standardization of Semiconductor Devices Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine-Pitch Ball Grid Array (FBGA)-IEC 60191-6-5:2001 |
|
CENELEC EN 60249-1+ A4 |
Base Materials for Printed Circuits Part 1. Test Methods (IEC 249-1 : 1982 + A1 : 1984 + A2 : 1989 + A3 : 1991 + A4:1993)(Incorporates Corrigendum May 1994) |
|
CENELEC EN 60252-2 |
AC motor capacitors Part 2: Motor start capacitors-IEC 60252-2:2003 |
|
CENELEC EN 60368-1 |
Piezoelectric filters of assessed quality Part 1: Generic specification-Includes amendment A1:2004; IEC 60368-1: 2000 |
|
CENELEC EN 60384-14-3 |
Fixed capacitors for use in electronic equipment Part 14-3: Blank detail specification Fixed capacitors for electromagnetic interference suppression and connection to the supply mains Assessment level DZ-IEC 60384-14-3:2004; Partially supersedes EN 132421:1997 |
|
CENELEC EN 60384-24-1 |
Fixed capacitors for use in electronic equipment Part 24-1: Blank detail specification - Surface mount fixed tantalum electrolytic capacitors with conductive polymer solid electrolyte - Assessment level EZ-IEC 60384-24-1:2006 |
|
CENELEC EN 60384-6-1 |
Fixed capacitors for use in electronic equipment Part 6-1: Blank detail specification - Fixed metallized polycarbonate film dielectric d.c. capacitors - Assessment level E-IEC 60384-6-1:2005 |
|
CENELEC EN 60512-11-11 |
Connectors for Electronic Equipment - Tests and Measurements - Part 11-11: Climatic Tests - Test 11k: Low Air Pressure-IEC 60512-11-11: 2002 |
|
CENELEC EN 60512-11-14 |
Connectors for electronic equipment Tests and measurements Part 11-14: Climatic tests Test 11p: Flowing single gas corrosion test-IEC 512-11-14:2003 |
|
CENELEC EN 60512-11-2 |
Connectors for Electronic Equipment - Tests and Measurements Part 11-2: Climatic Tests - Test 11b: Combined/Sequential Cold, Low Air Pressure and Damp Heat-IEC 60512-11-2: 2002 |
|
CENELEC EN 60512-12-7 |
Connectors for Electronic Equipment - Tests and Measurements Part 12-7: Soldering Tests - Test 12g: Solderability, Wetting Balance Method-IEC 60512-12-7: 2001; (E) |
|
CENELEC EN 60512-14-2 |
Connectors for electronic equipment - Tests and measurements Part 14-2: Sealing tests - Test 14b: Sealing - Fine air leakage-IEC 60512-14-2:2006 |
|
CENELEC EN 60512-14-6 |
Connectors for electronic equipment - Tests and measurements Part 14-6: Sealing tests - Test 14f: Interfacial sealing-IEC 60512-14-6:2006 |
|
CENELEC EN 60603-12 |
Connectors for Frequencies Below 3 MHz for Use with Printed Boards Part 12: Detail Specification for Dimensions, General Requirements and Tests for a Range of Sockets Designed for Use with Integrated Circuits-IEC 60603-12:1992 |
|
CENELEC EN 60603-8 |
Connectors for Frequencies Below 3 MHz for Use with Printed Boards Part 8: Two-Part Connectors for Printed Boards, for Basic Grid of 2,54 mm (0,1 in), with Square Male Contacts of 0,63 mm X 0,63 mm-IEC 60603-8:1990 |
|
CENELEC EN 60749-18 |
Semiconductor devices - Mechanical and climatic test methods Part 18: Ionizing radiation (total dose)-IEC 60749-18: 2002 |
|
CENELEC EN 60749-29 |
Semiconductor devices Mechanical and climatic test methods Part 29: Latch-up test-IEC 60749-29:2003 |
|
CENELEC EN 60749-5 |
Semiconductor devices Mechanical and climatic test methods Part 5: Steady-state temperature humidity bias life test-IEC 60749-5:2003 |
|
CENELEC EN 60749-7 |
Semiconductor Devices - Mechanical and Climatic Test Methods Part 7: Internal Moisture Content Measurement and the Analysis of Other Residual Gases-Partly Supersedes EN 60749: 1999 + A1: 2000 + A2: 2001 |
|
CENELEC EN 60838-2-2 |
Miscellaneous lampholders Part 2-2: Particular requirements - Connectors for LED-modules-IEC 60838-2-2:2006 |
|
CENELEC EN 60917-2-2 |
Modular Order for the Development of Mechanical Structures for Electronic Equipment Practices Part 2: Sectional Specification - Interface Co-Ordination Dimensions for the 25 mm Equipment Practice Section 2: Detail Specification - Dimensions for Subracks, Chassis, Backplanes, Front Panels and Plug-In Units-IEC 917-2-2: 1994 |
|
CENELEC EN 60938-2 |
Fixed Inductors for Electromagnetic Interference Suppression Part 2: Sectional Specification-Incorporates Amendment 1: February 2007 |
|
CENELEC EN 61076-3-112 |
Connectors for electronic equipment Part 3-112: Rectangular connectors Detail specification for rectangular connectors with four contacts for high performance serial bus for consumer audio/video equipment-IEC 61076-3-112:2006 |
|
CENELEC EN 61192-5 |
Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies |
|
CENELEC EN 61194 |
Characteristic Parameters of Stand- Alone Photovoltaic (PV) Systems (IEC 1194 : 1992, Modified) |
|
CENELEC EN 61249-2-23 |
Materials for printed boards and other interconnecting structures Part 2-23: Reinforced base materials, clad and unclad Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad-IEC 61249-2-23:2005 |
|
CENELEC EN 61360-2 |
Standard data element types with associated classification scheme for electric components Part 2: EXPRESS dictionary schema-Includes Amendment A1:2004; IEC 61360-2: 2002 + A1: 2003 |
|
CENELEC EN 61727 |
Photovoltaic (PV) Systems Characteristics of the Utility Interface (IEC 1727 : 1995) |
|
CENELEC EN 61760-1 |
Surface Mounting Technology Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)-IEC 61760-1:2006 |
|
CENELEC EN 61967-2 |
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method-IEC 61967-2:2005 |
|
CENELEC EN 61967-4 |
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 4: Measurement of conducted emissions - 1 ohm/150 ohm direct coupling method-Includes Amendment A1:2/2006; Corrigendum: 12/2006 |
|
CENELEC EN 61967-6 |
Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 6: Measurement of conducted emissions Magnetic probe method-IEC 61967-6: 2002 |
|
CENELEC EN 61988-3-1 |
Plasma display panels Part 3-1: Mechanical interface-IEC 61988-3-1:2005 |
|
CENELEC EN 62007-1 |
Semiconductor Optoelectronic Devices for Fibre Optic System Applications Part 1: Essential Ratings and Characteristics-IEC 62007-1: 1997 + A1: 1998 |
|
CENELEC EN 62132-5 |
Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz Part 5: Workbench Faraday cage method-IEC 62132-5:2005 |
|
CENELEC EN 62194 |
Method of evaluating the thermal performance of enclosures-IEC 62194: 2005 |
|
CENELEC EN 62197-1 |
Connectors for electronic equipment Quality assessment requirements Part 1: Generic specification-IEC 62197-1:2006 |
|
CENELEC EN 62373 |
Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET)-IEC 62373:2006 |
|
CEN EN ISO 17526 |
Optics and optical instruments Lasers and laser-related equipment Lifetime of lasers-ISO 17526:2003 |
|
CEN ENV 1954 |
Internal and External Fault Behaviour of Safety Related Electronic Parts of Gas Appliances |
|
CENELEC HD 195 S4 |
Safety Requirements for Mains Operated Electronic and Related Apparatus for Household and Similar General Use |
|
CENELEC HD 195 S5 |
Safety Requirements for Mains Operated Electronic and Related Apparatus for Household and Similar General Use |
|
CENELEC HD 203 |
Grid System for Printed Circuits |
|
CENELEC HD 313.2.1 |
Base Materials for Printed Circuits Part 2: Specifications Specification No 1: Phenolic Cellulose Paper Copper - Clad Laminated Sheet, High Electrical Quality |
|
CENELEC HD 313.2.1 S2 |
Base Materials for Printed Circuits Part 2: Specifications Specification No 1 : Phenolic Cellulose Paper Copper-Clad Laminated Sheet High Electrical Quality-Superseded by EN 60249-2-1: 1994 |
|
CENELEC HD 313.2.12 S1 |
Base Materials for Printed Circuits-Part 2: Specifications Specification No 12: Thin Epoxide Woven Glass Fabric Copper- Clad Laminated Sheet of Defined Flammability for Use in the Fabrication of Multilayer Printed Boards |
|
CENELEC HD 313.2.15 S1 |
Base Materials for Printed Circuits Part 2: Specifications Specification No. 15: Flexible Copper-Clad Polyimide Film, of Defined Flammability |
|
CENELEC HD 313.2.3 S1 |
Base Materials for Printed Circuits-Part 2: Specifications Specification No 3: Epoxide Cellulose Paper Copper-Clad Laminated Sheet of Defined Flammability (Vertical Burning Test) |
|
CENELEC HD 313.2.6 |
Base Materials for Printed Circuits Part 2: Specifications Specification No 6: Phenolic Cellulose Paper Copper- Clad Laminated Sheet of Defined Flammability (Horizontal Burning Test) |
|
CENELEC HD 313.2.7 S2 |
Base Materials for Printed Circuits Part 2: Specifications Specification No.7 : Phenolic Cellulose Paper Copper-Clad Laminated Sheet of Defined Flammability (Vertical Burning Test)-Superseded by EN 60249-2-7:1994 |
|
CENELEC HD 313.2.8 S1 |
Base Materials for Printed Circuits-Part 2: Specifications Specification No. 8: Flexible Copper-Clad Polyester (PETP) Film |
|
CENELEC HD 313.2.9 S1 |
Base Materials for Printed Circuits-Part 2: Specifications Specification No 9: Expoxide Cellulose Paper Core, Epoxide Glass Cloth Surfaces Copper- Clad Laminated Sheet of Defined Flammability (Vehicle Burning Test) |
|
CENELEC HD 334 S3 |
Marking Codes for Resistors and Capacitors |
|
CENELEC HD 493.2 S1 |
Dimensions of Mechanical Structures of the 482.6 mm (19 in) Series - Part 2: Cabinets and Pitches of Rack Structures |
|
CENELEC CECC 96 601 |
Blank Detail Specification: Slide switches |
|
CENELEC CLC/TS 50418 |
Safety of machinery - Electro-sensitive protective equipment - Passive infra-red protective devices (PIPDs) |
|
CENELEC EN 100015-2 |
Basic Specification: Protection of Electrostatic Sensitive Devices Part 2: Requirements for Low Humidity Conditions |
|
CENELEC EN 120006 |
Blank Detail Specification: PIN- Photodiodes for Fibre Optic Applications |
|
CENELEC EN 140201 |
Blank Detail Specification: Fixed Power Resistors (Assessment Level S)-Supersedes CECC 40 201: 1981 |
|
CENELEC EN 140202 |
Blank Detail Specification: Fixed Power Resistors (Assessment Level M)-Supersedes CECC 40 202: 1981 |
|
CENELEC EN 140400 |
Sectional Specification: Fixed Low Power Surface Mounting (SMD) Resistors |
|
CENELEC EN 165000-2 |
Film and Hybrid Integrated Circuits Part 2: Internal Visual Inspection and Special Tests |
|
CENELEC EN 196403 |
Blank Detail Specification: Push Button Switches Assessment Level Y |
|
CENELEC EN 60130-9 |
Connectors for Frequencies Below 3 MHz Part 9: Circular Connectors for Radio and Associated Sound Equipment-IEC 60130-9: 2000 |
|
CENELEC EN 60191-6-4 |
Mechanical standardization of semiconductor devices Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)-IEC 60191-6-4: 2003 |
|
CENELEC EN 60194 |
Printed board design, manufacture and assembly - Terms and definitions-IEC 60194:2006 |
|
CENELEC EN 60286-3 |
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes |
|
CENELEC EN 60297-3-104 |
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series Part 3-104: Connector dependent interface dimensions of subracks and plug-in units |
|
CENELEC EN 60384-13 |
Fixed capacitors for use in electronic equipment Part 13: Sectional specification - Fixed polypropylene film dielectric metal foil d.c. capacitors-Incorporating corrigendum November 2006 |
|
CENELEC EN 60384-13-1 |
Fixed capacitors for use in electronic equipment Part 13-1: Blank detail specification - Fixed polypropylene film dielectric metal foil d.c. capacitors - Assessment level E |
|
CENELEC EN 60384-23-1 |
Fixed capacitors for use in electronic equipment Part 23-1: Blank detail specification - Fixed surface mount metallized polyethylene naphthalate film dielectric DC capacitors - Assessment level EZ |
|
CENELEC EN 60384-24 |
Fixed capacitors for use in electronic equipment Part 24: Sectional specification - Surface mount fixed tantalum electrolytic capacitors with conductive polymer solid electrolyte-IEC 60384-24: 2006 |
|
CENELEC EN 60384-25-1 |
Fixed capacitors for use in electronic equipment Part 25-1: Blank detail specification - Surface mount fixed aluminium electrolytic capacitors with conductive polymer solid electrolyte - Assessment level EZ-IEC 60384-25-1:2006 |
|
CENELEC EN 60384-8-1 |
Fixed capacitors for use in electronic equipment Part 8-1: Blank detail specification: Fixed capacitors of ceramic dielectric, Class 1 Assessment level EZ-IEC 60384-8-1:2005 |
|
CENELEC EN 60384-9 |
Fixed capacitors for use in electronic equipment Part 9: Sectional specification: Fixed capacitors of ceramic dielectric, Class 2-(IEC 60384-9):2005;:1989 |
|
CENELEC EN 60512-12-4 |
Connectors for electronic equipment - Tests and measurements Part 12-4: Soldering tests - Test 12d: Resistance to soldering heat, solder bath method-Incorporating corrigendum December 2006 |
|
CENELEC EN 60512-23-3 |
Electromechanical Components for Electronic Equipment - Basic Testing Procedures and Measuring Methods Part 23-3: Test 23c: Shielding Effectiveness of Connectors and Accessories-IEC 60512-23-3:2000; Incorporating Corrigendum April 2003 |
|
CENELEC EN 60539-1 |
Directly Heated Negative Temperature Coefficient Thermistors Part 1: Generic Specification-IEC 60539-1: 2002 |
|
CENELEC EN 60603-4 |
Connectors for Frequencies Below 3 MHz for Use with Printed Boards Part 4: Two-Part Connectors for Printed Boards Having Contacts Spaced at 1,91 mm (0,075 in) Centres and Staggered Terminations at that Same Spacing-IEC 60603-4:1987 |
|
CENELEC EN 60603-7-4 |
Connectors for electronic equipment Part 7-4: Detail specification for 8-way, unshielded, free and fixed connectors, for data transmissions with frequencies up to 250 MHz-IEC 60603-7-4:2005 |
|
CENELEC EN 60749-14 |
Semiconductor devices - Mechanical and climatic test methods Part 14: Robustness of terminations (lead integrity)-IEC 60749-14:2003 |
|
CENELEC EN 60749-39 |
Semiconductor devices - Mechanical and climatic test methods Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components-IEC 60749-39:2006 |
|
CENELEC EN 60749-4 |
Semiconductor Devices Mechanical and Climatic Test Methods Part 4: Damp Heat, Steady State, Highly Accelerated Stress Test (HAST)-IEC 60749-4: 2002; Partially Supersedes EN 60749: 1999 + A1: 2000 + A2: 2001 |
|
CENELEC EN 61049 |
Capacitors for Use in Tubular Fluorescent and Other Discharge Lamp Circuits Performance Requirements (IEC 1049 : 1991 + Corrigendum 1992, Modified) |
|
CENELEC EN 61076-3-104 |
Connectors for electronic equipment - Product requirements Part 3-104: Detail specification for 8-way, shielded free and fixed connectors for data transmissions with frequencies up to 1 000 MHz-IEC 61076-3-104:2006 |
|
CENELEC EN 61076-4 |
Connectors with Assessed Quality, for Use in d.c., Low Frequency Analogue and in Digital High-Speed Data Applications - Part 4: Sectional Specification Printed Board Connectors-IEC 1076-4:1995 |
|
CENELEC EN 61076-7-100 |
Connectors for electronic equipment - Product requirements Part 7-100: Cable outlet accessories - Detail specification for a metric cable sealing consisting of an integrated part of heavy-duty rectangular or circular connector hoods and a sealing system |
|
CENELEC EN 61188-1-1 |
Printed Boards and Printed Board Assemblies - Design and Use Part 1-1: Generic Reqirements - Flatness Considerations for Electronic Assemblies-IEC 61188-1-1: 1997 |
|
CENELEC EN 61188-5-1 |
Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements-IEC 61188-5-1: 2002 |
|
CENELEC EN 61188-5-2 |
Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components-IEC 61188-5-2:2003 |
|
CENELEC EN 61188-5-4 |
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides |
|
CENELEC EN 61190-1-2 |
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
|
CENELEC EN 61249-5-1 |
Materials for Interconnection Structures Part 5. Sectional Specification Set for Conductive Foils and Films with and without Coatings Section 1. Copper Foils (for the Manufacture of Copper- Clad Base Materials) (IEC 1249-5-1 : 1995) |
|
CENELEC EN 61249-5-4 |
Materials for Interconnection Structures Part 5: Sectional Specification Set for Conductive Foils and Films with and without Coatings Section 4: Conductive Inks-IEC 1249-5-4: 1996 |
|
CENELEC EN 61249-8-8 |
Materials for Interconnection Structures Part 8: Sectional Specification Set for Non-Conductive Films and Coatings Section 8: Temporary Polymer Coatings-IEC 61249-8-8: 1997 |
|
CENELEC EN 61338-1-4 |
Waveguide type dielectric resonators Part 1-4: General information and test conditions - Measurement method of complex relative permittivity for dielectric resonator materials at millimetre-wave frequency-Incorporating corrigendum November 2006 |
|
CENELEC EN 61360-4 |
Standard data element types with associated classification scheme for electric components Part 4: IEC reference collection of standard data element types and component classes-Incorporates Corrigendum December 2005 |
|
CENELEC EN 61360-5 |
Standard data element types with associated classification scheme for electric components Part 5: Extensions to the EXPRESS dictionary schema-IEC 61360-5:2004 |
|
CENELEC EN 61921 |
Power capacitors Low-voltage power factor correction banks-IEC 61921:2003 |
|
CENELEC EN 61988-1 |
Plasma display panels Part 1: Terminology and letter symbols-IEC 61988-1: 2003 |
|
CENELEC EN 61988-2-2 |
Plasma display panels Part 2-2: Measuring methods Optoelectrical-IEC 61988-2-2:2003 |
|
CENELEC EN 62047-1 |
Semiconductor devices - Micro-electromechanical devices Part 1: Terms and definitions-IEC 62047-1: 2005 |
|
CENELEC EN 62258-6 |
Semiconductor die products Part 6: Requirements for information concerning thermal simulation-IEC 62258-6:2006;:1999 |
|
CENELEC EN 62421 |
Electronics assembly technology - Electronic modules |
|
CEN EN ISO 11810-2 |
Lasers and laser-related equipment - Test method and classification for the laser-resistance of surgical drapes and/or patient-protective covers - Part 2: Secondary ignition |
|
CENELEC ES 59008-5-1 |
Data Requirements for Semiconductor Die Part 5-1: Particular Requirements and Recommendations for Die Types - Bare Die |
|
CENELEC HD 249.2 |
Laboratory Resistors Part 2: Laboratory A.C. Resistors |
|
CENELEC HD 313.2.11 S1 |
Base Materials for Printed Circuits-Part 2: Specifications Specification No 11: Thin Epoxide Woven Glass Fabric Copper- Clad Laminated Sheet, General Purpose Grade for Use in the Fabrication of Multilayer Printed Boards |
|
CENELEC HD 313.2.11 S2 |
Base Materials for Printed Circuits Part 2: Specifications Specification No. 11: Thin Epoxide Woven Glass Fabric Copper-Clad Laminated Sheet, General Purpose Grade, for Use in the Fabrication of Multilayer Printed Boards-Superseded by EN 60249-2-11: 1994 |
|
CENELEC HD 313.2.2 S2 |
Base Materials for Printed Circuits Part 2: Specifications Specification No.2: Phenolic Cellulose Paper Copper-Clad Laminated Sheet, Economic Quality |
|
CENELEC HD 313.2.5 S1 |
Base Materials for Printed Circuits-Part 2: Specifications Specification No.5: Epoxide Woven Glass Fabric Copper-Clad, Laminated Sheet of Defined Flammability (Vertical Burning Test) |
|
CENELEC HD 363 |
Dimensions of Spindle Ends for Manually Operated Electronic Components |
|
CENELEC HD 370 S2 |
Modular Plug-in Unit and Standard 19-Inch Rack Amounting Unit Based on NIM Standard (for Electronic Nuclear Instruments) |
|
CENELEC EN 100015-3 |
Basic Specification: Protection of Electrostatic Sensitive Devices Part 3: Requirements for Clean Room Areas |
|
CENELEC EN 100015-4 |
Basic Specification: Protection of Electrostatic Sensitive Devices Part 4: Requirements for High Voltage Environments |
|
CENELEC EN 120001 |
Blank Detail Specification: Light Emitting Diodes, Light Emitting Diode Arrays, Light Emitting Diode Displays Without Internal Logic and Resistor |
|
CENELEC EN 120005 |
Blank Detail Specification: Photodiodes, Photodiode- Arrays (Not Intended for Fibre Optic Applications) |
|
CENELEC EN 130301 |
Blank Detail Specification: Aluminium Electrolytic Capacitors with Non-Solid Electrolyte-Supersedes CECC 30 301: 1988 |
|
CENELEC EN 130700/PRA1 |
AMD prA1 Sectional Specification: Fixed Capacitors of Ceramic Dielectric, Class 2 |
|
CENELEC EN 153000 |
Generic Specification: Discrete Pressure Contact Power Semiconductor Devices (Qualification Approval) |
|
CENELEC EN 175301-803 |
Detail Specification: Rectangular connectors - Flat contacts, 0,8 mm thickness, locking screw not detachable |
|
CENELEC EN 50065-4-5 |
Signalling on low-voltage electrical installations in the frequency range 3 kHz to 148,5 kHz Part 4-5: Low voltage decoupling filter - Segmentation filter |
|
CENELEC EN 60191-3 |
Mechanical Standardization of Semiconductor Devices Part 3: General Rules for the Preparation of Outline Drawings of Integrated Circuits-IEC 60191-3:1999 |
|
CENELEC EN 60191-6-2 |
Mechanical Standardization of Semiconductor Devices Part 6-2: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for 1,50 mm, 1,27 mm and 1,00 mm Pitch Ball and Column Terminal Packages-IEC 60191-6-2:2001 |
|
CENELEC EN 60384-16 |
Fixed capacitors for use in electronic equipment Part 16: Sectional specification: Fixed metallized polypropylene film dielectric d.c. capacitors-:2002; IEC 60384-16:2005 |
|
CENELEC EN 60384-2-1 |
Fixed capacitors for use in electronic equipment Part 2-1: Blank detail specification: Fixed metallized polyethylene-terephthalate film dielectric d.c. capacitors Assessment levels E and EZ-IEC 60384-2-1:2005 |
|
CENELEC EN 60384-3 |
Fixed capacitors for use in electronic equipment Part 3: Sectional specification: Surface mount fixed tantalum electrolytic capacitors with manganese dioxide solid electrolyte |
|
CENELEC EN 60384-9-1 |
Fixed capacitors for use in electronic equipment Part 9-1: Blank detail specification: Fixed capacitors of ceramic dielectric, Class 2 Assessment level EZ-IEC 60384-9-1:2005 |
|
CENELEC EN 60512-11-5 |
Connectors for Electronic Equipment - Tests and Measurements Part 11-5: Climatic Tests - Test 11e: Mould Growth-IEC 60512-11-5: 2002 |
|
CENELEC EN 60512-12-5 |
Connectors for electronic equipment - Tests and measurements Part 12-5: Soldering tests - Test 12e: Resistance to soldering heat, soldering iron method-Incorporating corrigendum December 2006 |
|
CENELEC EN 60512-13-1 |
Connectors for electronic equipment - Tests and measurements Part 13-1: Mechanical operation tests - Test 13a: Engaging and separating forces-Incorporates Corringendum December 2006 |
|
CENELEC EN 60512-13-2 |
Connectors for electronic equipment - Tests and measurements Part 13-2: Mechanical operation tests - Test 13b: Insertion and withdrawal forces-IEC 60512-13-2:2006 |
|
CENELEC EN 60539-2 |
Directly heated negative temperature coefficient thermistors Part 2: Sectional specification - Surface mount negative temperature coefficient thermistors-IEC 60539-2:2003 |
|
CENELEC EN 60603-1 |
Connectors for Frequencies Below 3 MHz for Use with Printed Boards - Part 1: Generic Specification - General Requirements and Guide for the Preparation of Detail Specifications, with Assessed Quality-IEC 60603-1: 1991 + A1: 1992 |
|
CENELEC EN 60603-2 |
Connectors for Frequencies Below 3 MHz for Use with Printed Boards Part 2: Detail Specification for Two-Part Connectors with Assessed Quality, for Printed Boards, for Basic Grid of 2,54 mm (0,1 in) with Common Mounting Features-Includes amendment A1:2005; IEC 60603-2:1995 + A1: 2000 |
|
CENELEC EN 60603-5 |
Connectors for Frequencies Below 3 MHz for Use with Printed Boards Part 5: Edge-Socket Connectors and Two-Part Connectors for Double-Sided Printed Boards with 2,54 mm (0,1 in) Spacing-IEC 60603-5:1987 |
|
CENELEC EN 60603-9 |
Connectors for Frequencies Below 3 MHz for Use with Printed Boards Part 9: Two-Part Connectors for Printed Boards, Backpanels and Cable Connectors, Basic Grid of 2,54 mm (0,1 in)-IEC 60603-9:1990 |
|
CENELEC EN 60749-10 |
Semiconductor Devices - Mechanical and Climatic Test Methods Part 10: Mechanical Shock-IEC 60749-10: 2002; Partly Supersedes EN 60749: 1999 + A1: 2000 + A2: 2001 |
|
CENELEC EN 60749-2 |
Semiconductor Devices Mechanical and Climatic Test Methods Part 2: Low Air Pressure-IEC 60749-2: 2002; Partially Supersedes EN 60749: 1999 + A1: 2000 + A2: 2001 |
|
CENELEC EN 60749-3 |
Semiconductor Devices Mechanical and Climatic Test Methods Part 3: External Visual Examination-IEC 60749-3: 2002; Partly Supersedes EN 60749: 1999 + A1: 2000 + A2: 2001 |
|
CENELEC EN 60749-35 |
Semiconductor devices Mechanical and climatic test methods Part 35: Acoustic microscopy for plastic encapsulated electronic components |
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CENELEC EN 60917-2-1 |
Modular Order for the Development of Mechanical Structures for Electronic Equipment Practices Part 2: Sectional Specification Interface Co-Ordination Dimensions for the 25 mm Equipment Practice Section 1: Detail Specification - Dimensions for Cabinets and Racks-IEC 917-2-1: 1993 |
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CENELEC EN 60917-2-3 |
Modular order for the development of mechanical structures for electronic equipment practices Part 2-3: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Extended detail specification - Dimensions for subracks, chassis, backplanes, front panels and plug-in units-IEC 60917-2-3:2006 |
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CENELEC EN 61076-4-111 |
Connectors for Electronic Equipment Part 4-111: Printed Board Connectors with Assessed Quality - Detail Specification for Two-Part Power Connector Modules, for Printed Boards and Backplanes Having Early Mating Features, and Having a Basic Grid of 2,5 mm in Accordance with IEC 60917-1-IEC 61076-4-111: 2002 |
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CENELEC EN 61076-4-113 |
Connectors for electronic equipment - Printed board connectors Part 4-113: Detail specification for two-part connectors having 5 rows with grid of 2,54 mm for printed boards and backplans in bus applications-IEC 61076-4-113:2002 |