|
CENELEC EN 61169-2 |
Radio-frequency connectors - Part 2: Sectional specification - Radio frequency coaxial connectors of type 9,52 |
|
CENELEC EN 61189-6 |
Test methods for electrical materials, interconnection structures and assemblies Part 6: Test methods for materials used in manufacturing electronic assemblies-IEC 61189-6:2006 |
|
CENELEC EN 61193-1 |
Quality Assessment Systems - Part 1: Registration and Analysis of Defects on Printed Board Assemblies-IEC 61193-1: 2001 |
|
CENELEC EN 61249-2-1 |
Materials for printed boards and other interconnecting structures Part 2-1: Reinforced base materials, clad and unclad Phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad (IEC 61249-2-1:2005) |
|
CENELEC EN 61249-2-2 |
Materials for printed boards and other interconnecting structures Part 2-2: Reinforced base materials, clad and unclad – Phenolic cellulose paper reinforced laminate sheets, high electrical grade, copper-clad-IEC 61249-2-2:2005 |
|
CENELEC EN 61249-2-9 |
Materials for printed boards and other interconnecting structures Part 2-9: Reinforced base materials clad and unclad Bismaleimide/triazine, modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad-IEC 61249-2-9:2003 |
|
CENELEC EN 61249-4-2 |
Materials for printed boards and other interconnecting structures Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability-IEC 61249-4-2: 2005 |
|
CENELEC EN 61338-1-3 |
Waveguide Type Dielectric Resonators - Part 1-3: General Information and Test Conditions - Measurement Method of Complex Relative Permittivity for Dielectric Resonator Materials at Microwave Frequency test conditions - Measurement Method of Complex Relative Permittivity for Dielectric Resonator Materials at Microwave Frequency-IEC 61338-1-3:1999 |
|
CENELEC EN 61829 |
Crystalline Silicon Photovoltaic (PV) Array On-Site Measurement of I-V Characteristics-IEC 61829:1995 |
|
CENELEC EN 61965 |
Mechanical safety of cathode ray tubes-IEC 61965: 2003 |
|
CENELEC EN 62047-2 |
Semiconductor devices Micro-electromechanical devices Part 2: Tensile testing method of thin film materials-IEC 62047-2:2006 |
|
CENELEC EN 62137-1-2 |
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test |
|
CENELEC EN 62258-5 |
Semiconductor die products Part 5: Requirements for information concerning electrical simulation-IEC 62258-5:2006;:1999 |
|
CENELEC EN 62319-1 |
Polymeric thermistors - Directly heated positive step function temperature coefficient Part 1: Generic specification-IEC 62319-1:2005 |
|
CENELEC EN 62391-1 |
Fixed electric double-layer capacitors for use in electronic equipment Part 1: Generic specification-IEC 62391-1:2006 |
|
CENELEC EN 62391-2-1 |
Fixed electric double-layer capacitors for use in electronic equipment Part 2-1: Blank detail specification - Electric-double layer capacitors for power application - Assessment level EZ-IEC 62391-2-1:2006 |
|
CENELEC ES 59008-4-1 |
Data Requirements for Semiconductor Die - Part 4-1: Specific Requirements and Recommendations Test and Quality |
|
CENELEC ES 59008-4-2 |
2001 Data Requirements for Semiconductor Die - Part 4-2: Specific Requirements and Recommendations Handling and Storage |
|
CENELEC ES 59008-5-3 |
Data Requirements for Semiconductor Die - Part 5-3: Particular Requirements and Recommendations for Die Types - Minimally-Packaged Die |
|
CENELEC HD 145 |
Numbering of Electrodes and Designation of Units in Electronic Tubes and Valves |
|
CENELEC HD 207 |
Recommendation for Capacitors for Inductive Heat Generating Plants Operating at Frequencies Between 40 and 24000 Hz |
|
CENELEC HD 313.1.S4 |
Base Materials for Printed Circuits - Part 1: Test Methods |
|
CENELEC HD 313.2.13 S1 |
Base Materials for Printer Circuits-Part 2: Specifications Specification No. 13: Flexible Copper-Clad Polyimide Film, General Purpose Grade |
|
CENELEC HD 313.2.2 S3 |
Base Materials for Printed Circuits Part 2: Specifications Specification No. 2: Phenolic Cellulose Paper Copper-Clad Laminated Sheet, Economic Quality-Superseded by EN 60249-2-2: 1994 |
|
CENELEC HD 313.2.5 S2 |
Base Materials for Printed Circuits Part 2: Specifications Specification No.5: Epoxide Woven Glass Fabric Copper-Clad Laminated Sheet of Defined Flammability (Vertical Burning Test)-Superseded by EN 60249-2-5:1994 |
|
CENELEC HD 313.2.6 S2 |
Base Materials for Printed Circuits Part 2: Specifications Specification No. 6: Phenolic Cellulose Paper Copper-Clad Laminated Sheet of Defined Flammability (Horizontal Burning Test)-Superseded by EN 60249-2-6:1994 |
|
CENELEC HD 313.2.9 S2 |
Base Materials for Printed Circuits Part 2: Specifications Specification No.9: Epoxide Cellulose Paper Core, Epoxide Glass Cloth Surfaces Copper- Clad Laminated Sheet of Defined Flammability (Vertical Burning Test) |
|
CENELEC HD 349 |
Preferred Diameters of Wire Terminations of Capacitors and Resistors |
|
CENELEC HD 391 S3 |
Dimensions for the Mounting of Single-Hole, Bush-Mounted, Spindle- Operated Electronic Components |
|
CENELEC HD 493.1 S1 |
Dimensions of Mechanical Structures of the 482.6 mm (19 in) Series - Part 1: Panels and Racks |
|
CENELEC HD 493.3 S1 |
Dimensions of Mechanical Structures of the 482.6 mm (19 in) Series - Part 3: Subracks and Associated Plug-in Units |
|
CENELEC HD 525.2 S1/ A1 |
AMD 1 Shunt Capacitors for A.C. Power Systems Having a Rated Voltage Above 660V Part 2: Endurance Testing |
|
CENELEC EN 100012 |
Basic Specification: X-Ray Inspection of Electronic Components |
|
CENELEC EN 120000 |
Generic Specification: Semiconductor Optoelectronic and Liquid Crystal Devices-Superseded by EN 61747-1: 1999 |
|
CENELEC EN 120007 |
Blank Detail Specification: Liquid Crystal Displays Monochrome LCDs without Electronic Circuit |
|
CENELEC EN 129202 |
Blank Detail Specification: Wirewound Inductors with Ceramic or Ferrite Core. Assessment Level P (Includes Amendment A1 : 1995) |
|
CENELEC EN 130600 PRA1 |
AMD prA1 Sectional Specification: Fixed Capacitors of Ceramic Dielectric, Class 1 |
|
CENELEC EN 135000 |
Generic Specification: Travelling Wave Amplifier Tubes |
|
CENELEC EN 140400/A1 |
Sectional Specification: Fixed Low Power Surface Mounting (SMD) Resistors-Ratified European Text:04/01/2000 |
|
CENELEC EN 50065-4-7 |
Signalling on lowvoltage electrical installations in the frequency range 3 kHz to 148,5 kHz and 1,6 MHz to 30 MHz Part 4-7: Portable low voltage decoupling filters - Safety requirements-Incorporating corrigendum October 2006 |
|
CENELEC EN 50324-1 |
Piezoelectric Properties of Ceramic Materials and Components Part 1: Terms and Definitions |
|
CENELEC EN 60068-2-82 |
Environmental testing - Part 2-82: Tests - Test Tx: Whisker test methods for electronic and electric components |
|
CENELEC EN 60143 |
Series Capacitors for Power Systems Part 1: General - Performance, Testing and Rating - Safety Requirements - Guide Installation (IEC 143 : 1992) |
|
CENELEC EN 60143-3 |
Series Capacitors for Power Systems Part 3: Internal Fuses-IEC 60143-3:1998 |
|
CENELEC EN 60191-6-13 |
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) |
|
CENELEC EN 60191-6-3 |
Mechanical Standardization of Semiconductor Devices - Part 6-3: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Measuring Methods for Package Dimensions of Quad Flat Packs (QFP)-IEC 60191-6-3:2000 |
|
CENELEC EN 60191-6-8 |
Mechanical Standardization of Semiconductor Devices Part 6-8: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Glass Sealed Ceramic Quad Flatpack (G-QFP)-IEC 60191-6-8:2001 |
|
CENELEC EN 60249-2-4 |
Base Materials for Printed Circuits Part 2: Specifications Specification No.4: Epoxide Woven Glass Fabric Copper-Clad Laminated Sheet, General Purpose Grade-Including Amendments A3:1994, A4:1995 and A5:2000; IEC 249-2-4:1987 + A1:1989 + A2:1992 + A3:1993 + A4:1994 + A5:2000; Supersedes HD 313.2.4 S2:1990 |
|
CENELEC EN 60384-19 |
Fixed capacitors for use in electronic equipment Part 19: Sectional specification - Fixed metallized polyethylene-terephthalate film dielectric surface mount d.c. capacitors-Incorporates Corrigendum: November 2006 |
|
CENELEC EN 60384-19-1 |
Fixed capacitors for use in electronic equipment Part 19-1: Blank detail specification - Fixed metallized polyethylene-terephthalate film dielectric surface mount d.c. capacitors - Assessment level EZ-Incorporating corrigendum November 2006 |
|
CENELEC EN 60384-4 |
Fixed capacitors for use in electronic equipment - Part 4: Sectional specification - Aluminium electrolytic capacitors with solid (MnO2) and non-solid electrolyte |
|
CENELEC EN 60384-6 |
Fixed capacitors for use in electronic equipment Part 6: Sectional specification – Fixed metallized polycarbonate film dielectric d.c. capacitors-IEC 60384-6:2005 |
|
CENELEC EN 60512-12-1 |
Connectors for electronic equipment - Tests and measurements Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method-IEC 60512-12-1:2006 |
|
CENELEC EN 60512-12-2 |
Connectors for electronic equipment - Tests and measurements Part 12-2: Soldering tests - Test 12b: Solderability, wetting, soldering iron method-Incorporating corrigendum December 2006 |
|
CENELEC EN 60512-13-5 |
Connectors for electronic equipment - Tests and measurements Part 13-5: Mechanical operation tests - Test 13e: Polarizing and keying method-IEC 60512-13-5:2006 |
|
CENELEC EN 60512-14-5 |
Connectors for electronic equipment - Tests and measurements Part 14-5: Sealing tests - Test 14e: Immersion at low air pressure-IEC 60512-14-5:2006 |
|
CENELEC EN 60512-25-7 |
Connectors for electronic equipment Tests and measurements Part 25-7: Test 25g Impedance, reflection coefficient and voltage standing wave ratio (VSWR)-IEC 60512-25-7:2004 |
|
CENELEC EN 60603-10 |
Connectors for Frequencies Below 3 MHz for Use with Printed Boards Part 10: Two-Part Connectors for Printed Boards for Basic Grid of 2,54 mm (0,1 in), Inverted Type-IEC 60603-10:1991 |
|
CENELEC EN 60603-14 |
Connectors for Frequencies Below 3 MHz for Use with Printed Boards Part 14: Detail Specification for Circular Connectors for Low-Frequency Audio and Video Applications Such as Audio, Video and Audio-Visual Equipment-IEC 60606-14:1998 |
|
CENELEC EN 60603-3 |
Connectors for Frequencies Below 3 MHz for Use with Printed Boards Part 3: Two-Part Connectors for Printed Boards Having Contacts Spaced at 2,54 mm (0,1 in) Centres and Staggered Terminations at that Same Spacing-IEC 60603-3:1987 |
|
CENELEC EN 60603-6 |
Connectors for Frequencies Below 3 MHz for Use with Printed Boards Part 6: Edge-Socket Connectors and Printed Board Connectors with 2,54 mm (0,1 in) Contact Spacing for Single or Double-Sided Printed Boards of 1,6 mm (0,063 in) Nominal Thickness-IEC 60603-6:1987 |
|
CENELEC EN 60747-15 |
Discrete semiconductor devices Part 15: Isolated power semiconductor devices-IEC 60747-15:2003 |
|
CENELEC EN 60749-27 |
Semiconductor devices - Mechanical and climatic test methods Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)-IEC 60749-27:2006 |
|
CENELEC EN 60749-8 |
Semiconductor devices - Mechanical and climatic test methods Part 8: Sealing-IEC 60749-8: 2002 + corrigendum: 2003 |
|
CENELEC EN 60915 |
Fixed capacitors and resistors for use in electronic equipment - Preferred dimensions of shaft ends, bushes and for the mounting of single-hole, bush-mounted, shaft-operated electronic components |
|
CENELEC EN 60938-1 |
Fixed inductors for electromagnetic interference suppression Part 1: Generic specification-Incorporating Amendment A1: 02/2007 |
|
CENELEC EN 61076-2 |
Connectors for Use in d.c. Low-Frequency Analogue and Digital High-Speed Data Applications - Part 2: Circular Connectors with Assessed Quality - Sectional Specification-IEC 61076-2: 1998 |
|
CENELEC EN 61076-2-001 |
Connectors for Electronic Equipment Part 2-001: Circular Connectors - Blank Detail Specification-IEC 61076-2-001:2001 |
|
CENELEC EN 61076-3-106 |
Connectors for electronic equipment - Product requirements Part 3-106: Rectangular connectors - Detail specification for protective housings for use with 8-way shielded and unshielded connectors for industrial environments incorporating the IEC 60603-7 series interface |
|
CENELEC EN 61188-1-2 |
Printed Boards and Printed Board Assemblies - Design and Use Part 1-2: Generic Requirements - Controlled Impedance-IEC 61188-1-2:1998 |
|
CENELEC EN 61188-5-3 |
Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides |
|
CENELEC EN 61188-5-6 |
Printed boards and printed board assemblies Design and use Part 5-6: Attachment (land/joint) considerations Chip carriers with J-leads on four sides-IEC 61188-5-6:2003 |
|
CENELEC EN 61249-2-10 |
Materials for printed boards and other interconnecting structures Part 2-10: Reinforced base materials clad and unclad Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad-IEC 61249-2-10:2003; Incorporates Corrigendum July 2005 |
|
CENELEC EN 61249-2-22 |
Materials for printed boards and other interconnecting structures Part 2-22: Reinforced base materials, clad and unclad Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad-IEC 61249-2-22:2005 |
|
CENELEC EN 61249-3-3 |
Materials for Printed Boards and Other Interconnecting Structures Part 3-3: Sectional Specification Set for Unreinforced Base Materials, Clad and Unclad (Intended for Flexible Printed Boards) Adhesive Coated Flexible Polyester Film-IEC 61249-3-3: 1999 |
|
CENELEC EN 61249-3-4 |
Materials for Printed Boards and Other Interconnecting Structures Part 3-4: Sectional Specification Set for Unreinforced Base Materials, Clad and Unclad (Intended for Flexible Printed Boards) - Adhesive Coated Flexible Polyimide Film-IEC 61249-3-4: 1999 |
|
CENELEC EN 61249-3-5 |
Materials for Printed Boards and Other Interconnecting Structures - Part 3-5: Sectional Specification Set for Unreinforced Base Materials, Clad and Unclad (Intended for Flexible Printed Boards) - Transfer Adhesive Films for Flexible Printed Boards-IEC 61249-3-5: 1999 |
|
CENELEC EN 61338-1 |
Waveguide type dielectric resonators Part 1: Generic specification-Supersedes EN 170000:1999 |
|
CENELEC EN 61338-4 |
Waveguide type dielectric resonators Part 4: Sectional specification-IEC 61338-4: 2005 |
|
CENELEC EN 61338-4-1 |
Waveguide type dielectric resonators Part 4-1: Blank detail specification-IEC 61338-4-1: 2005 |
|
CENELEC EN 61360-1 |
Standard Data Element Types with Associated Classification Scheme for Electric Components Part 1 : Definitions - Principles and Methods-Including Amendment A1: 2004; IEC 61360-1: 2002, Modified |
|
CENELEC EN 61643-321 |
Components for Low-Voltage Surge Protective Devices Part 321: Specifications for Avalanche Breakdown Diode (ABD)-IEC 61643-321: 2001 |
|
CENELEC EN 61943 |
Integrated Circuits - Manufacturing Line Approval Application Guideline-IEC 61943:1999 |
|
CENELEC EN 61988-2-1 |
Plasma display panels Part 2-1: Measuring methods - Optical-IEC 61988-2-1:2002 |
|
CENELEC EN 62007-2 |
Semiconductor Optoelectronic Devices for Fibre Optic System Applications Part 2: Measuring Methods-IEC 62007-2: 1997 + A1: 1998 |
|
CENELEC EN 62132-3 |
Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 3: Bulk current injection (BCI) method |
|
CENELEC EN 62137-1-1 |
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test |
|
CENELEC EN 62319-1-1 |
Polymeric thermistors - Directly heated positive step function temperature coefficient Part 1-1: Blank detail specification - Current limiting application-IEC 62319-1-1:2005 |
|
CENELEC ES 59008-5-2 |
Data Requirements for Semiconductor Die Part 5-2: Particular Requirements and Recommendations for Die Types - Bare Die with Added Connection Structures |
|
CENELEC HD 195 S6 |
Safety Requirements for Mains Operated Electronic and Related Apparatus for Household and Similar General Use |
|
CENELEC HD 249 |
Laboratory D.C. Resistors |
|
CENELEC HD 313.1 S5 |
Base Materials for Printed Circuits Part 1: Test Methods |
|
CENELEC HD 313.2.10 S1 |
Base Materials for Printed Circuits-Part 2: Specifications Specification No 10: Epoxide Non-Woven/Woven Glass Reinforced Copper- Clad Laminated Sheet of Defined Flammability (Vertical Burning Test) |
|
CENELEC HD 313.2.10 S2 |
Base Materials for Printed Circuits Part 2: Specifications Specification No. 10: Epoxide Non-Woven Glass Reinforced Copper-Clad Laminated Sheet of Defined Flammability (Vertical Burning Test) |
|
CENELEC HD 313.2.10 S3 |
Base Materials for Printed Circuits Part 2: Specifications Specification No. 10: Epoxide Non-Woven/Woven Glass Reinforced Copper- Clad Laminated Sheet of Defined Flammability (Vertical Burning Test)-Superseded by EN 60249-2-9:1994 |
|
CENELEC HD 313.2.12 S2 |
Base Materials for Printed Circuits Part 2: Specifications Specification No. 12: Thin Epoxide Woven Glass Fabric Copper-Clad Laminated Sheet of Defined Flammability, for Use in the Fabrication of Multilayer Printed Boards-Superseded by EN 60249-2-12: 1994 |
|
CENELEC HD 313.2.14 S1 |
Base Materials for Printed Circuits Part 2: Specifications Specification No 14: Phenolic Cellulose Paper Copper-Clad Laminated Sheet of Defined Flammability (Vertical Turning Test) Economic Quality |
|
CENELEC HD 313.2.14 S2 |
Base Materials for Printed Circuits Part 2: Specifications Specification No. 14: Phenolic Cellulose Paper Copper-Clad Laminated Sheet of Defined Flammability (Vertical Burning Test), Economic Quality-Superseded by EN 60249-2-14: 1994 |
|
CENELEC HD 313.2.3 S2 |
Base Materials for Printed Circuits Part 2: Specifications Specification No.3: Epoxide Cellulose Paper Copper-Clad Laminated Sheet of Defined Flammability (Vertical Burning Test)-Superseded by EN 60 249-2-3: 1994 |
|
CENELEC HD 313.2.4 S1 |
Base Materials for Printed Circuits-Part 2: Specifications. Specification No.4: Epoxide Woven Glass Fabric Copper-Clad Laminated Sheet, General Purpose Grade |
|
CENELEC HD 313.2.7 S1 |
Base Materials for Printed Circuits-Part 2: Specifications Specification No.7: Phenolic Cellulose Paper Copper-Clad Laminated Sheet of Defined Flammability (Vertical Burning Test) |
|
CENELEC HD 313.2.9 S3 |
Base Materials for Printed Circuits Part 2: Specifications Specification No. 9: Epoxide Cellulose Paper Core, Epoxide Glass Cloth Surfaces Copper- Clad Laminated Sheet of Defined Flammability (Vertical Burning Test) |
|
CENELEC HD 334 S2 |
Marking Codes for Resistors and Capacitors |
|
CENELEC HD 469 |
Expression of the Properties of Logic Analysers |
|
CENELEC HD 493.3 S2 |
Dimensions of Mechanical Structures of the 482.6 mm (19 in) Series - Part 3: Subracks and Associated Plug-in Units-Superseded by EN 60297-3-101:2004 |
|
CENELEC HD 525.1 S1 |
Shunt Capacitors for a.c. Power Systems Having a Rated Voltage Above 660 V Part 1: General Performance, Testing and Rating Safety Requirements - Guide for Installation and Operation; (IEC 871-1: 1987) |
|
CENELEC HD 525.2 S1 |
Shunt Capacitors for a.c. Power Systems Having a Rated Voltage Above 660v Part 2: Endurance Testing |
|
CENELEC HD 597 S1 CORR 1 |
CORRIGENDUM Coupling Capacitors and Capacitor Dividers |