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DIN 41622-1 |
Multipole Connectors with Blade Contacts 3 × 1 mm; Dimensions |
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DIN EN 61076-3-112 |
(DRAFT) Connectors for electronic equipment - Part 3-112: Rectangular connectors - Detail specification: Rectangular connectors with four contacts for high performance serial bus used for consumer audio/video equipments (IEC 48B/1478/CDV:2004); German version prEN 61076-3-112:2004 |
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DIN IEC 60352-5 |
(DRAFT) Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance (IEC 48B/1602/CD:2005) |
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DIN 43460 |
Contact assignment for circuit breakers rated for voltages lower than 52 kV - Assignment of auxiliary and control circuits to contact pins in plug connectors |
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DIN EN 61360-4 |
Standard data element types with associated classification scheme for electric components - Part 4: IEC reference collection of standard data element types and component classes (IEC 61360-4:2005); German version EN 61360-4:2005, text in English |
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DIN IEC 60050-581 |
(DRAFT) International Electrotechnical Vocabulary - Part 581: Electromechanical components for electronic equipment (IEC 1/1982/CDV:2006) |
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DIN IEC 60297-3-100 |
(DRAFT) Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19in) series - Part 3-100: Basic dimensions of front panels, subracks, chassis, racks and cabinets (IEC 48D/355/CD:2007) |
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DIN IEC 60747-1 |
(DRAFT) Semiconductor devices - Part 1: General (IEC 47/1734/CD:2003) |
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DIN IEC 60747-4 |
(DRAFT) Semiconductor devices - Discrete devices - Part 4: Microwave diodes and transistors (IEC 47E/265/CD:2004) |
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DIN IEC 60748-2-20 |
(DRAFT) Semiconductor devices - Integrated circuits - Part 2-20: Digital integrated circuits - Family specification - Low voltage integrated circuits (IEC 47A/755/CD:2006) |
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DIN IEC 61076-3-107 |
(DRAFT) Connectors for electronic equipment - Detail specification for shielded rectangular connectors for universal serial bus plus power connectors, series A (IEC 48B/1209/CD:2002) |
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DIN IEC 61076-3-114 |
(DRAFT) Connectors for electronic equipment - Part 3-114: Rectangular connectors - Protective housings for use with 8-way shielded and unshielded connectors for frequencies up to 600 MHz for industrial environments incorporating the IEC 60603-7 series interface - Variant 11 related to IEC 61076-3-106 - Bayonet coupling type (IEC 48B/1667/CD:2006) |
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DIN IEC 61076-3-115 |
(DRAFT) Connectors for electronic equipment - Part 3-115: Rectangular connectors - Protective housings for use with 8-way shielded and unshielded connectors for frequencies up to 600 MHz for industrial environments incorporating the IEC 60603-7 series interface - Variant 12 related to IEC 61076-3-106 - Push-pull type (IEC 48B/1668/CD:2006) |
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DIN IEC 61190-1-2 |
(DRAFT) Attachment materials for electronic assembly - Part 1-2 : Requirements for soldering paste for high-quality interconnects in electronics assembly (IEC 91/520/CD:2005) |
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DIN IEC 61587-1 |
(DRAFT) Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 1: Climatic, mechanical tests and safety aspects for cabinets, racks and subracks (IEC 48D/325/CD:2005) |
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DIN IEC 62374 |
(DRAFT) Time Dependent Dielectric Breakdown Test (TDDB) (IEC 47/1764/CD:2004) |
|
DIN ISO 10110-17 |
Optics and photonics - Preparation of drawings for optical elements and systems - Part 17: Laser irradiation damage threshold (ISO 10110-17:2004) |
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DIN EN 140100 |
(DRAFT) Sectional specification: Fixed low power film resistors; German version prEN 140100:2006 |
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DIN EN 140101 |
(DRAFT) Blank detail specification: Fixed low power film resistor; German version prEN 140101:2006 |
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DIN EN 140101-806 |
(DRAFT) Detail specification: Fixed low power film resistors - Metal film resistors on high grade ceramic, conformal coated or molded, axial or preformed leads; German version prEN 140101-806:2006 |
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DIN EN 140401-801 |
(DRAFT) Detail specification: Fixed low power film SMD resistors - Rectangular - Stability classes 0,1; 0,25; 0,5; 1; German version prEN 140401-801:2006 |
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DIN EN 140401-802 |
(DRAFT) Detail specification: Fixed low power film SMD resistors - Rectangular - Stability classes 1; 2; German version prEN 140401-802:2006 |
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DIN EN 140401-803 |
(DRAFT) Detail specification: Fixed low power film SMD resistors - Cylindrical - Stability classes 0,05; 0,1; 0,25; 0,5; 1; 2; German version prEN 140401-803:2006 |
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DIN EN 175301-801 |
(DRAFT) Detail Specification: High density rectangular connectors, round removable crimp contacts; German version prEN 175301-801:2005 |
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DIN EN 190000 |
Generic specification: Monolithic integrated circuits; German version EN 190000:1995 |
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DIN EN 50279 |
(DRAFT) Visual display units - Measuring methods for low frequency electric and magnetic fields; German version prEN 50279:1997 |
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DIN EN 60191-6-13 |
(DRAFT) Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top type socket for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) (IEC 47D/620/CDV:2005); German version prEN 60191-6-13:2005 |
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DIN EN 60191-6-16 |
(DRAFT) Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor test and burn-in socket for BGA, LGA, FBGA and FLGA (IEC 47D/621/CDV:2005); German version prEN 60191-6-16:2005 |
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DIN EN 60194 |
Printed board design, manufacture and assembly - Terms and definitions (IEC 60194:2006); German version EN 60194:2006, text in English |
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DIN EN 60393-1 |
(DRAFT) Potentiometers for use in electronic equipment - Part 1: Generic specification (IEC 40/1799/CDV:2006); German version prEN 60393-1:2006 |
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DIN EN 60603-7 |
(DRAFT) Connectors for electronic equipment - Part 7: Detail specification for 8-way, unshielded, free and fixed connectors (IEC 48B/1746/CDV:2007); German version prEN 60603-7:2007 |
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DIN EN 60617-5 |
Graphical symbols for diagrams - Part 5: Semiconductors and electron tubes (IEC 60617-5:1996); German version EN 60617-5:1996 |
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DIN EN 60738-1-1 |
(DRAFT) Thermistors - Directly heated positive step-function temperature coefficient - Part 1-1: Blank detail specification - Current limiting application - Assessment level EZ (IEC 40/1829/CDV:2007); German version prEN 60738-1-1:2007 |
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DIN EN 60738-1-2 |
(DRAFT) Thermistors - Directly heated positive step-function temperature coefficient - Part 1-2: Blank detail specification - Heating element application - Assessment level EZ (IEC 40/1830/CDV:2007); German version prEN 60738-1-2:2007 |
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DIN EN 60738-1-3 |
(DRAFT) Thermistors - Directly heated positive step-function temperature coefficient - Part 1-3: Blank detail specification - Inrush current application - Assessment level EZ (IEC 40/1831/CDV:2007); German version prEN 60738-1-3:2007 |
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DIN EN 60749-26 |
(DRAFT) Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) (IEC 47/1803/CDV:2005); German version prEN 60749-26:2005 |
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DIN EN 60749-27 |
(DRAFT) Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) (IEC 47/1804/CDV:2005); German version prEN 60749-27:2005 |
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DIN EN 61188-5-3 |
(DRAFT) Printed boards and printed board assemblies - design and use - Part 5-3: Sectional requirements - attachment (land/joint) considerations - components with gull-wing leads on two sides (IEC 91/463/CDV:2004); German version prEN 61188-5-3:2004 |
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DIN EN 61188-5-4 |
(DRAFT) Printed boards and printed board assemblies - Design and use - Part 5-4: Sectional requirements - Attachment (land/joint) consideration - Components with J leads on two sides (IEC 91/464/CDV:2004); German version prEN 61188-5-4:2004 |
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DIN EN 61188-5-5 |
(DRAFT) Printed board and printed board assemblies - Design and use - Part 5-5: Sectional requirements - Attachment (land/joint) considerations - Components with gull-wing leads on four sides (IEC 91/465/CDV:2004); German version prEN 61188-5-5:2004 |
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DIN EN 61249-2-31 |
(DRAFT) Materials for printed boards and other interconnecting structures - Part 2-31: Reinforced base materials clad and unclad for high frequency application - Halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less than 4.1 at 1 GHz) and flammability (vertical burning test), copper-clad (IEC 91/671/CDV:2007); German version prEN 61249-2-31:2007 |
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DIN EN 61249-2-32 |
(DRAFT) Materials for printed boards and other interconnecting structures - Part 2-32: Reinforced base materials clad and unclad for high frequency application - Halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less than 3.7 at 1 GHz) and flammability (vertical burning test), copper-clad (IEC 91/673/CDV:2007); German version prEN 61249-2-32:2007 |
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DIN EN 61249-2-33 |
(DRAFT) Materials for printed boards and other interconnecting structures - Part 2-33: Reinforced base materials clad and unclad for high frequency application - Non-halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less than 4.1 at 1 GHz) and flammability (vertical burning test), copper-clad (IEC 91/675/CDV:2007); German version prEN 61249-2-33:2007 |
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DIN EN 61249-2-34 |
(DRAFT) Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials clad and unclad for high frequency application - Non-halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less than 3.7 at 1 GHz) and flammability (vertical burning test), copper-clad (IEC 91/677/CDV:2007); German version prEN 61249-2-34:2007 |
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DIN EN 61249-2-35 |
(DRAFT) Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials clad and unclad - Modified epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 91/655/CDV:2007); German version prEN 61249-2-35:2007 |
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DIN EN 61249-2-36 |
(DRAFT) Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 91/657/CDV:2007); German version prEN 61249-2-36:2007 |
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DIN EN 61249-2-37 |
(DRAFT) Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 91/659/CDV:2007); German version prEN 61249-2-37:2007 |
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DIN EN 61249-2-38 |
(DRAFT) Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials clad and unclad - Non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 91/661/CDV:2007); German version prEN 61249-2-38:2007 |
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DIN EN 61249-4-1 |
(DRAFT) Materials for interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (IEC 91/573/CDV:2005); German version prEN 61249-4-1:2005 |
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DIN EN 61249-4-14 |
(DRAFT) Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 91/663/CDV:2007); German version prEN 61249-4-14:2007 |
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DIN EN 61249-4-15 |
(DRAFT) Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 91/665/CDV:2007); German version prEN 61249-4-15:2007 |
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DIN EN 61249-4-16 |
(DRAFT) Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 91/667/CDV:2007); German version prEN 61249-4-16:2007 |
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DIN EN 61249-4-17 |
(DRAFT) Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 91/669/CDV:2007); German version prEN 61249-4-17:2007 |
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DIN EN 61360-2 |
Standard data element types with associated classification scheme for electric components - Part 2: EXPRESS dictionary schema (IEC 61360-2:2002 + A1:2003); German version EN 61360-2:2002 + A1:2004, text English |
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DIN EN 61360-5 |
Standard data element types with associated classification scheme for electric components - Part 5: Extensions to the EXPRESS dictionary schema (IEC 61360-5:2004); German version EN 61360-5:2004, text English |
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DIN EN 61523-1 |
Delay and power calculation standards - Part 1: Integrated circuit delay and power calculation systems (IEC 61523-1:2001); German version EN 61523-1:2002, text in English |
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DIN EN 61523-2 |
Delay and power calculation standards - Part 2: Pre-layout delay calculation specification for CMOS ASIC libraries (IEC 61523-2:2002); German version EN 61523-2:2002, text in English |
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DIN EN 62014-1 |
Electronic design automation libraries - Part 1: Input/output buffer information specifications (IBIS version 3.2) (IEC 62014-1:2001); German version EN 62014-1:2002 |
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DIN EN 62258-2 |
Semiconductor die products - Part 2: Exchange data formats (IEC 62258-2:2005); German version EN 62258-2:2005, text in English |
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DIN EN ISO 11145 |
Optics and photonics - Lasers and laser-related equipment - Vocabulary and symbols (ISO 11145:2006) |
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DIN EN ISO 11146-1 |
Lasers and laser-related equipment - Test methods for laser beam widths, divergence angles and beam propagation ratios - Part 1: Stigmatic and simple astigmatic beams (ISO 11146-1:2005) |
|
DIN EN ISO 11146-2 |
Lasers and laser-related equipment - Test methods for laser beam widths, divergence angles and beam propagation ratios - Part 2: General astigmatic beams (ISO 11146-2:2005) |
|
DIN EN ISO 11151-1 |
Lasers and laser-related equipment - Standard optical components - Part 1: Components for the UV, visible and near-infrared spectral range (ISO 11151-1:2000); English version of DIN EN ISO 11151-1 |
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DIN EN ISO 11151-2 |
Lasers and laser-related equipment - Standard optical components - Part 2: Components for the infrared spectral range (ISO 11151-2:2000); English version of DIN EN ISO 11151-2 |
|
DIN EN ISO 11252 |
Lasers and laser-related equipment - Laser device - Minimum requirements for documentation (ISO 11252:2004) |
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DIN EN ISO 11254-1 |
Lasers and laser-related equipment - Determination of laser-induced damage threshold of optical surfaces - Part 1: 1-on-1 test (ISO 11254-1:2000); English version of DIN EN ISO 11254-1 |
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DIN EN ISO 11254-2 |
Determination of laser-induced damage threshold of optical surfaces - Part 2: S-on-1 test (ISO 11254-2:2001) |
|
DIN EN ISO 11254-3 |
Lasers and laser-related equipment - Determination of laser-induced damage threshold of optical surfaces - Part 3: Assurance of laser power (energy) handling capabilities (ISO 11254-3:2006) |
|
DIN EN ISO 11551 |
Optics and optical instruments - Lasers and laser-related equipment - Test method for absorptance of optical laser components (ISO 11551:2003) |
|
DIN EN ISO 11553-1 |
Safety of machinery - Laser processing machines - Part 1: General safety requirements (ISO 11553-1:2005) |
|
DIN EN ISO 11554 |
Optics and photonics - Lasers and laser-related equipment - Test methods for laser beam power, energy and temporal characteristics (ISO 11554:2006) |
|
DIN EN ISO 11670 |
Lasers and laser-related equipment - Test methods for laser beam parameters - Beam positional stability (ISO 11670:2003) |
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DIN EN ISO 11670 Berichtigung 1 |
Corrigenda to DIN EN ISO 11670:2003-10 |
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DIN EN ISO 11807-1 |
Integrated optics - Vocabulary - Part 1: Basic terms and symbols (ISO 11807-1:2001) |
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DIN EN ISO 11807-2 |
Integrated optics - Vocabulary - Part 2: Terms used in classification (ISO 11807-2:2001) |
|
DIN EN ISO 11810-1 |
Lasers and laser-related equipment - Test method and classification for the laser resistance of surgical drapes and/or patient protective covers - Part 1: Primary ignition and penetration (ISO 11810-1:2005) |
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DIN EN ISO 11990 |
Optics and optical instruments - Lasers and laser-related equipment - Determination of laser resistance of tracheal tube shafts (ISO 11990:2003) |
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DIN EN ISO 13694 |
Lasers and laser-related equipment - Test methods for laser beam power (energy) density distribution (ISO 13694:2000); English version of DIN EN ISO 13694 |
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DIN EN ISO 13695 |
Optics and photonics - Lasers and laser-related equipment - Test methods for the spectral characteristics of lasers (ISO 13695:2004) |
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DIN EN ISO 13697 |
Optics and photonics - Lasers and laser-related equipment - Test methods for specular reflectance and regular transmittance of optical laser components (ISO 13697:2006) |
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DIN EN ISO 14880-1 |
Microlens array - Part 1: Vocabulary (ISO 14880-1:2001 + Corr. 1:2003) |
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DIN EN ISO 14880-2 |
Optics and photonics - Microlens arrays - Part 2: Test methods for wavefront aberrations (ISO 14880-2:2006) |
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DIN EN ISO 14880-3 |
Optics and photonics - Microlens arrays - Part 3: Test methods for optical properties other than wavefront aberrations (ISO 14880-3:2006) |
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DIN EN ISO 14880-4 |
Optics and photonics - Microlens arrays - Part 4: Test methods for geometrical properties (ISO 14880-4:2006) |
|
DIN EN ISO 15367-1 |
Lasers and laser-related equipment - Test methods for determination of the shape of a laser beam wavefront - Part 1: Terminology and fundamental aspects (ISO 15367-1:2003) |
|
DIN EN ISO 15367-2 |
Lasers and laser-related equipment - Test methods for determination of the shape of a laser beam wavefront - Part 2: Shack-Hartmann sensors (ISO 15367-2:2005) |
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DIN EN ISO 15902 |
Optics and photonics - Diffractive optics - Vocabulary (ISO 15902:2004) |
|
DIN EN ISO 17526 |
Optic and optical instruments - Lasers and laser-related equipment - Lifetime of lasers (ISO 17526:2003) |
|
DIN EN ISO 22827-1 |
Acceptance tests for Nd:YAG laser beam welding machines - Machines with optical fibre delivery - Part 1: Laser assembly (ISO 22827-1:2005) |
|
DIN EN ISO 22827-2 |
Acceptance tests for Nd:YAG laser beam welding machines - Machines with optical fibre delivery - Part 2: Moving mechanism (ISO 22827-2:2005) |
|
DIN EN ISO 24013 |
Optics and photonics - Lasers and laser-related equipment - Measurement of phase retardation of optical components for polarized laser radiation (ISO 24013:2006) |
|
DIN IEC 40/1119/CD |
(DRAFT) Amendment 2 to IEC 60384-10: Fixed capacitors for use in electronic equipment - Part 10: Sectional specification; fixed multilayer ceramic chip capacitors (IEC 40/1119/CD:1999) |
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DIN IEC 47A/596/CD |
(DRAFT) IEC 62113: Integrated circuits - Product discontinuance notification by suppliers and distributors (IEC 47A/596/CD:2000) |
|
DIN IEC 60115-8 |
(DRAFT) Fixed resistors for use in electronic equipment - Part 8: Sectional specification: Fixed surface mount (SMD) resistors (IEC 40/1457/CD:2004) |
|
DIN IEC 60115-8-1 |
(DRAFT) Fixed resistors for use in electronic equipment - Part 8-1 Blank detail specification: Fixed surface mount (SMD) resistors - Assessment level EZ (IEC 40/1458/CD:2004) |
|
DIN IEC 60191-1 |
(DRAFT) Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 47D/607A/CD:2005) |
|
DIN IEC 60191-6-14 |
(DRAFT) Mechanical standardization of semiconductor devices - Part 6-14: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 47D/671/CD:2006) |
|
DIN IEC 60191-6-15 |
(DRAFT) Mechanical standardization of semiconductor devices - Part 6-15: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 47D/673/CD:2006) |
|
DIN IEC 60235-1 |
Measurement of the Electrical Properties of Microwave Tubes; Part 1: Terminologie |
|
DIN IEC 60286-2 |
(DRAFT) Packing of components for automatic handling - Part 2: Tape packing of components with unidirectional leads on continuous tapes. (IEC 40/1744/CD:2006) |
|
DIN IEC 60286-3 |
(DRAFT) Packing of components for automatic handling - Part 3: Packing of surface mount components on continous tapes (IEC 40/1433/CD:2004) |
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DIN IEC 60286-3-VI |
(DRAFT) Packaging of components for automatic handling - Part 3: Type VI: Packaging of surface mount components on blister carrier tapes 4 mm in width (IEC 40/1782/CD:2006) |
|
DIN IEC 60297-3-105 |
(DRAFT) Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19in) series - Part 3-105: Dimensions and design aspects for 1U chassis (IEC 48D/354/CD:2007) |
|
DIN IEC 60384-11 |
(DRAFT) Fixed capacitors for use in electronic equipment - Part 11: Sectional specification: Fixed polyethylene terephthalate film dielectric metal foil d.c.capacitors (IEC 40/1786/CD:2006) |
|
DIN IEC 60384-11-1 |
(DRAFT) Fixed capacitors for use in electronic equipment - Part 11-1: Blank detail specification: Fixed polyethylene terephthalate film dielectric metal foil d.c. capacitors - Assessment level E (IEC 40/1787/CD:2006) |
|
DIN IEC 60384-18 |
(DRAFT) Fixed capacitors for use in electronic equipment - Part 18: Sectional specification - Fixed aluminium electrolytic surface mount capacitors with solid (MnO2) and non-solid electrolyte (IEC 40/1613/CD:2005) |
|
DIN IEC 60384-18-1 |
(DRAFT) Fixed capacitors for use in electronic equipment - Part 18-1: Blank detail specification: Fixed aluminium electrolytic surface mount capacitors with solid (MnO2) electrolyte - Assessment level EZ (IEC 40/1614/CD:2005) |
|
DIN IEC 60384-18-2 |
(DRAFT) Fixed capacitors for use in electronic equipment - Part 18-2: Blank detail specification: Fixed aluminium electrolytic surface mount capacitors with non solid electrolyte - Assessment level EZ (IEC 40/1615/CD:2005) |
|
DIN IEC 60384-20 |
(DRAFT) Fixed capacitors for use in electronic equipment - Part 20: Sectional specification: Fixed metallized polyphenylene sulfide film dielectric surface mount d.c. capacitors (IEC 40/1767/CD:2006) |
|
DIN IEC 60384-20-1 |
(DRAFT) Fixed capacitors for use in electronic equipment - Part 20-1: Blank detail specification: Fixed metallized polyphenylene sulfide film dielectric surface mount d.c. capacitors - Assessment level EZ (IEC 40/1768/CD:2006) |
|
DIN IEC 60384-3 |
(DRAFT) Fixed capacitors for use in electronic equipment - Part 3: Sectional specification: Fixed surface mount tantalum capacitors (IEC 40/1449/CD:2004) |
|
DIN IEC 60384-3-1 |
(DRAFT) Fixed capacitors for use in electronic equipment - Part 3-1: Blank detail specification - Fixed surface mount tantalum capacitors - Assessment level E (IEC 40/1450/CD:2004) |
|
DIN IEC 60384-4 |
(DRAFT) Fixed capacitors for use in electronic equipment - Part 4: Sectional specification - Aluminium electrolytic capacitors with solid (MnO2) and non-solid electrolyte (IEC 40/1610/CD:2005) |
|
DIN IEC 60384-4-1 |
(DRAFT) Fixed capacitors for use in electronic equipment - Part 4-1: Blank detail specification - Fixed aluminium electrolytic capacitors with non-solid electrolyte - Assessment level EZ (IEC 40/1611/CD:2005) |
|
DIN IEC 60384-4-2 |
(DRAFT) Fixed capacitors for use in electronic equipment - Part 4-2: Blank detail specification: Fixed aluminium electrolytic capacitors with solid (MnO2) electrolyte - Assessment level EZ (IEC 40/1612/CD:2005) |
|
DIN IEC 60512-16-1 |
(DRAFT) Connectors for electronic equipment - Tests and measurements - Part 16-1: Mechanical tests on contacts and terminations - Test 16a: Probe damage (IEC 48B/1561/CD:2005) |
|
DIN IEC 60512-16-11 |
(DRAFT) Connectors for electronic equipment - Tests and measurements - Part 16-11: Mechanical tests on contacts and terminations - Test 16k: Stripping force, solderless wrapped connections (IEC 48B/1570/CD:2005) |
|
DIN IEC 60512-16-13 |
(DRAFT) Connectors for electronic equipment - Tests and measurements - Part 16-13: Mechanical tests on contacts and terminations - Test 16m: Unwrapping, solderless wrapped connections (IEC 48B/1571/CD:2005) |
|
DIN IEC 60512-16-14 |
(DRAFT) Connectors for electronic equipment - Tests and measurements - Part 16-14: Mechanical tests on contacts and terminations - Test 16n: Bending strength fixed male tabs (IEC 48B/1572/CD:2005) |
|
DIN IEC 60512-16-16 |
(DRAFT) Connectors for electronic equipment - Tests and measurements - Part 16-16: Mechanical tests on contacts and terminations - Test 16p: Torsional strength, fixed male tabs (IEC 48B/1573/CD:2005) |
|
DIN IEC 60512-16-17 |
(DRAFT) Connectors for electronic Equipment - Tests and measurements - Part 16-17: Mechanical tests on contacts and terminations - Test 16q: Tensile and compressive strength, fixed male tabs (IEC 48B/1574/CD:2005) |
|
DIN IEC 60512-16-3 |
(DRAFT) Connectors for electronic equipment - Tests and measurements - Part 16-3: Mechanical tests on contacts and terminations - Test 16c: Contact bending strength (IEC 48B/1563/CD:2005) |
|
DIN IEC 60512-16-5 |
(DRAFT) Connectors for electronic equipment - Tests and measurements - Part 16-5: Mechanical tests on contacts and terminations - Test 16e: Gauge retention force (resilient contacts) (IEC 48B/1565/CD:2005) |
|
DIN IEC 60512-16-6 |
(DRAFT) Connectors for electronic equipment - Tests and measurements - Part 16-6: Mechanical tests on contacts and terminations - Test 16f: Robustness of terminations (IEC 48B/1566/CD:2005) |
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DIN IEC 60512-16-7 |
(DRAFT) Connectors for electronic equipment - Tests and measurements - Part 16-7: Mechanical tests on contacts and terminations - Test 16g: Measurement of contact deformation after crimping (IEC 48B/1567/CD:2005) |
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DIN IEC 60512-16-8 |
(DRAFT) Connectors for electronic equipment - Tests and measurements - Part 16-8: Mechanical tests on contacts and terminations - Test 16h: Insulating grip effectiveness (crimped connections) (IEC 48B/1568/CD:2005) |
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DIN IEC 60512-16-9 |
(DRAFT) Connectors for electronic equipment - Tests and measurements - Part 16-9: Mechanical tests on contacts and terminations - Test 16i: Grounding contact spring holding force (IEC 48B/1569/CD:2005) |
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DIN IEC 60512-25-1 |
(DRAFT) Connectors for Electronic Equipment - Tests and Measurements - Part 25-1: Test 25a - Crosstalk ratio (IEC 48B/1431/CD:2004) |
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DIN IEC 60512-25-9 |
(DRAFT) Connectors for electrical equipment - Test and measurements - Part 25-9: Signal integrity tests - Test 25i: Alien crosstalk (IEC 48B/1536/CD:2005) |
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DIN IEC 60512-26-100 |
(DRAFT) Connectors for electronic equipment - Tests and measurements - Part 26-100: Measurement setup, test and reference arrangements and measurements for interoperability and backward compatibility tests for connectors according to IEC 60603-7 (tests 26a to 26g) (IEC 48B/1690/CD:2006) |
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DIN IEC 60539-1 |
(DRAFT) Directly heated negative temperature coefficient thermistors - Part 1: Generic specification (IEC 40/1769/CD:2006) |
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DIN IEC 60603-7-1 |
(DRAFT) Connectors for electronic equipment - Part 7-1: Detail specification for 8-way, shielded, free and fixed connectors (IEC 48B/1698/CD:2006) |
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DIN IEC 60603-7-2 |
(DRAFT) Connectors for electronic equipment - Part 7-2: Detail specification for 8-way, unshielded, free and fixed connectors, for data transmission with frequencies up to 100 MHz (IEC 48B/1293/CD:2003) |
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DIN IEC 60603-7-41 |
(DRAFT) Connectors for electronic equipment - Part 7-41: Detail specification for 8-way, unshielded, free and fixed connectors, for data transmission with frequencies up to 500 MHz (IEC 48B/1693/CD:2006) |
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DIN IEC 60603-7-5 |
(DRAFT) Connectors for electronic equipment - Part 7-5: Detail specification for 8-way, shielded, free and fixed connectors, for data transmissions with frequencies up to 250 MHz (CAT 6, shielded) (IEC 48B/1223/CD:2002) |
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DIN IEC 60603-7-51 |
(DRAFT) Connectors for electronic equipment - Part 7-51: Detail specification for 8-way, shielded, free and fixed connectors, for data transmission with frequencies up to 500 MHz (IEC 48B/1694/CD:2006) |
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DIN IEC 60603-7-71 |
(DRAFT) Connectors for electronic equipment - Part 7-71: Detail specification for 8-way, shielded, free and fixed connectors, for data transmission with frequencies up to 1000 MHz (IEC 48B/1695/CD:2006) |
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DIN IEC 60679-1 |
(DRAFT) Quartz crystal controlled oscillators of assessed quality - Part 1: Generic specification (IEC 49/710/CD:2005) |
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DIN IEC 60689 |
(DRAFT) Measurements and test methods for 200 kHz or less quartz crystal units and standard values (IEC 49/747/CD:2005) |
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DIN IEC 60747-14-4 |
(DRAFT) Discrete semiconductor devices - Part 14-4: Semiconductor accelerometers (IEC 47E/220/CD:2002) |
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DIN IEC 60747-14-5 |
(DRAFT) Semiconductor devices - Discrete devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor (IEC 47E/326/CD:2007) |
|
DIN IEC 60747-15 |
(DRAFT) Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices (IEC 47E/322/CD:2007) |
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DIN IEC 60747-16-1/A1 |
(DRAFT) Semiconductor devices - Discrete devices - Part 16-1: Microwave integrated circuits - Amplifiers (IEC 47E/264/CD:2004) |
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DIN IEC 60747-8 |
(DRAFT) Semiconductor devices - Discrete devices - Part 8: Field-effect transistors (IEC 47E/320/CD:2007) |
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DIN IEC 60747-9 |
(DRAFT) Semiconductor devices - Discrete devices - Part 9: Insulated gate bipolar transistors (IGBTs) (IEC 47E/258/CD:2004) |
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DIN IEC 60749-20-1 |
(DRAFT) Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling, shipping and use of moisture/reflow sensitive surface mount devices (IEC 47/1775/CD:2004) |
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DIN IEC 60749-28 |
(DRAFT) Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing; Charged device model (CDM) (IEC 47/1658/CD:2002) |
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DIN IEC 60749-38 |
(DRAFT) Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error rate testing of electronic components (IEC 47/1796/CD:2004) |
|
DIN IEC 60749-39 |
(DRAFT) Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used in integrated circuits (IEC 47/1797/CD:2004) |
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DIN IEC 60758 |
(DRAFT) Synthetic quartz crystal - Specifications and guide to the use (IEC 49/771/CD:2007) |
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DIN IEC 60915 |
(DRAFT) Preferred dimensions of shaft ends, bushes and for the mounting of single-hole, bush-mounted, shaft-operated electronic components (IEC 40/1592/CD:2005) |
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DIN IEC 60917-2-3 |
(DRAFT) Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification; Interface co-ordination dimensions for the 25 mm equipment practice; Section 3: Extended detail specification; Dimensions for subracks chassis, backplanes, front panels, and plug-in units (IEC 48D/285/CD:2003) |
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DIN IEC 61045-1 |
(DRAFT) Fixed film resistor networks for use in electronic equipment - Part 1: Generic specification (IEC 40/1616/CD:2005) |
|
DIN IEC 61051-1 |
(DRAFT) Varistors for use in electronic equipement - Part 1: Generic specification (IEC 40/1617/CD:2005) |
|
DIN IEC 61076-1 |
(DRAFT) Connectors - Product requirements - Part 1: Generic specification (Ed. 2) (IEC 48B/880/CD:2000) |
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DIN IEC 61076-2-104 |
(DRAFT) Connectors for electronic equipment - Part 2-104: Circular connectors - Detail specification for M8 connectors with screw- or snap-locking for low voltage applications (IEC 48B/1485/CD:2004) |
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DIN IEC 61076-2-105 |
(DRAFT) Connectors for electronic equipment - Part 2-105: Detail specification for circular connectors M5 with screw-locking for low voltage applications (IEC 48B/1601/CD:2005) |
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DIN IEC 61076-3 |
(DRAFT) Connectors for electronic equipment - Part 3: Rectangular connectors - Sectional specification (IEC 48B/1358/CD:2003) |
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DIN IEC 61076-3-001 |
(DRAFT) Connectors for electronic equipment - Part 3-001: Rectangular connectors - Blank detail specification (IEC 48B/1359/CD:2003) |
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DIN IEC 61076-3-104 |
(DRAFT) Connectors for electronic equipment - Part 3-104: Rectangular Connectors - Detail specification for 8-way, shielded free and fixed connectors for data transmission with frequencies up to 1000 MHz (IEC 48B/1438/CD:2004) |
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DIN IEC 61076-3-106 |
(DRAFT) Connectors for electronic equipment - Part 3-106: 8 way connectors for industrial environments (IEC 48B/1165/CD:2002) |
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DIN IEC 61076-3-108 |
(DRAFT) Connectors for electronic equipment - Detail specification for shielded rectangular connectors for universal serial bus plus power connectors, series B (IEC 48B/1210/CD:2002) |
|
DIN IEC 61076-3-110 |
(DRAFT) Connectors for electronic equipment - Part 3-110: Rectangular connectors; Detail specification for 8-way, shielded, free and fixed connectors for data transmission with frequencies up to 600 MHz (IEC 48B/1360/CD:2003) |
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DIN IEC 61076-3-113 |
(DRAFT) Connectors for electronic equipment - Part 3-113: Screened, serial multi-conductor cable to board connectors suitable for 10 Gbit/sec data rates (IEC 48B/1437/CD:2004) |
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DIN IEC 61076-3-116 |
(DRAFT) Connectors for electronic equipment - Part 3-116: Rectangular connectors - Protective housings for use with 8-way shielded and unshielded connectors for frequencies up to 600 MHz for industrial environments incorporating the IEC 60603-7 series interface - Variant 13 related to IEC 61076-3-106 - Bayonet coupling with spring clamp (IEC 48B/1669/CD:2006) |
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DIN IEC 61076-3-117 |
(DRAFT) Connectors for electronic equipment - Product Requirements - Part 3-117: Rectangular connectors: Protective housings for use with 8-way shielded and unshielded connectors for frequencies up to 1000 MHz for industrial environments incorporating the 60603-7 - Variant 14 related to IEC 61076-3-106 - Push pull coupling (IEC 48B/1743/CD:2006) |
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DIN IEC 61076-7-100 |
(DRAFT) Connectors for electronic equipment - Part 7-100: Cable outlet accessories - Detail specification for a metric cable sealing consisting of an integrated part of heavy-duty rectangular or circular connector hoods and a sealing system (IEC 48B/1439/CD:2004) |
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DIN IEC 61163-3 |
(DRAFT) Reliability stress screening - Part 3: Reliability screening of repairable single items (IEC 56/951/CD:2004) |
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DIN IEC 61188-5-8 |
(DRAFT) Printed board and printed board assemblies - Design and use - Part 5-8 : Sectional Requirement - Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) (IEC 91/416/CD:2003) |
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DIN IEC 61189-2/A2 |
(DRAFT) Amendment 2 to IEC 61189-2: Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (IEC 91/313/CD:2002) |
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DIN IEC 61189-3/A2 |
(DRAFT) Amendment 2 to IEC 61189-3: Test methods for electrical material, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (IEC 91/314/CD:2002) |
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DIN IEC 61192-5 |
(DRAFT) Product performance requirements - Part 5: Rework, modification and repair of soldered electronic assemblies (IEC 91/326/CD:2002) |
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DIN IEC 61193-2 |
(DRAFT) Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages (IEC 91/509/CD:2005) |
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DIN IEC 61249-6-3 |
(DRAFT) Materials for interconnection structures - Part 6-3: Sectional specification for reinforcements; Woven fibreglass fabrics (IEC 91/393/CD:2003) |
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DIN IEC 61587-1 |
(DRAFT) Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 1: Climatic, mechanical tests and safety aspects for cabinets, racks and subracks (IEC 48D/325/CD:2005) |
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DIN IEC 61747-5-2 |
(DRAFT) Liquid crystal display devices - Part 5-2: Visual Inspection of Active Matrix Liquid Crystal Display Modules (IEC 110/75/CD:2006) |
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DIN IEC 61747-6-2 |
(DRAFT) Liquid crystal display devices - Part 6-2: Measuring methods for liquid crystal display modules - Reflective type (IEC 110/105/CD:2007) |
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DIN IEC 61747-6-3 |
(DRAFT) Liquid crystal display devices - Part 6-3: Motion Artifact Measurement of Active Matrix Liquid Crystal Display Modules (IEC 110/86/CD:2006) |
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DIN IEC 61760-2 |
(DRAFT) Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide (IEC 91/461/CD:2004) |
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DIN IEC 61967-3 |
(DRAFT) Integrated circuits - Measurement of electromagnetic emissions; 150 kHz to 1 GHz - Part 3: Measurement of radiated emissions - Surface scan method (IEC 47A/674/CD:2003) |
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DIN IEC 61967-6/A1 |
(DRAFT) Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic Probe method (IEC 47A/720/CD:2005) |
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DIN IEC 61988-2-3 |
(DRAFT) Plasma Display Panels - Part 2-3: Measuring methods - Quality (IEC 110/52/CD:2005) |
|
DIN IEC 61988-3-2 |
(DRAFT) Plasma Display Panels - Part 3-2: Electrical interface (IEC 110/63/CD:2005) |
|
DIN IEC 61988-5 |
(DRAFT) Plasma Display Panels - Part 5: Generic specification (IEC 110/80/CD:2006) |
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DIN IEC 61994-1 |
(DRAFT) Piezoelectric and dielectric devices for frequency control and selection - Glossary - Part 1: Piezoelectric and dielectric resonators (IEC 49/755/CD:2006) |
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DIN IEC 61994-4-1 |
(DRAFT) Piezoelectric and dielectric devices for frequency control and selection - Glossary - Part 4-1: Piezoelectric materials - Synthetic quartz crystal (IEC 49/756/CD:2006) |
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DIN IEC 61994-4-4 |
(DRAFT) Piezoelectric and dielectric devices for frequency control and selection - glossary - Part 4-4: Materials - Materials for SAW devices (IEC 49/642/CD:2004) |
|
DIN IEC 62024-1 |
(DRAFT) High frequency inductive components - Electrical characteristics and measuring methods - Part 1: Nanohenry range chip inductor (IEC 51/881/CD:2006) |
|
DIN IEC 62047-2 |
(DRAFT) Microelectromechanical devices - Part 2: Tensile testing method of thin film materials (IEC 47/1759/CD:2004) |
|
DIN IEC 62047-3 |
(DRAFT) Microelectromechanical devices - Part 3: Thin film standard test piece (IEC 47/1760/CD:2004) |
|
DIN IEC 62047-4 |
(DRAFT) Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS (IEC 47/1857/CD:2006) |
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DIN IEC 62047-6 |
(DRAFT) Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 47/1900/CD:2007) |
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DIN IEC 62132-3 |
(DRAFT) Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 3: Bulk Current Injection (BCI), 10 kHz to 1 GHz (IEC 47A/670/CD:2003) |
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DIN IEC 62137-1-1 |
(DRAFT) Surface mount technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test (IEC 91/519/CD:2005) |
|
DIN IEC 62137-1-2 |
(DRAFT) Surface mount technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test (IEC 91/523/CD:2005) |
|
DIN IEC 62137-1-3 |
(DRAFT) Surface-mount technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test (IEC 91/614/CD:2006) |
|
DIN IEC 62197-1 |
(DRAFT) Connectors - Quality assessment requirements - Part 1: Generic specification (IEC 48B/879/CD:2000) |
|
DIN IEC 62215-2 |
(DRAFT) Integrated circuits - Measurement of impulse immunity - Part 2: Fast Impulse Injection method (IEC 47A/730/CD:2005) |
|
DIN IEC 62258-3 |
(DRAFT) Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage (IEC 47/1750/CD:2004) |
|
DIN IEC 62258-5 |
(DRAFT) Semiconductor die products - Part 5: Requirements for information concerning electrical simulation (IEC 47/1807/CD:2005) |
|
DIN IEC 62258-6 |
(DRAFT) Semiconductor die products - Part 6: Requirements for information concerning thermal simulation (IEC 47/1808/CD:2005) |
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DIN IEC 62326-3 |
(DRAFT) Printed boards - Part 3: Safety certification of rigid printed circuit boards for electronic assemblies (IEC 91/384/CD:2003) |
|
DIN IEC 62341-1 |
(DRAFT) Organic Light Emitting Diode Displays - Part 1: Generic specification (IEC 110/38/CD:2004) |
|
DIN IEC 62341-2 |
(DRAFT) Organic Light Emitting Diode Displays - Part 2: Terminology (IEC 110/20/CD:2004) |
|
DIN IEC 62341-6 |
(DRAFT) Organic Light Emitting Diode Displays - Part 6: Measuring Methods (IEC 110/55/CD:2005) |
|
DIN IEC 62373 |
(DRAFT) Bias-Temperature Stability Test for MOSFET (IEC 47/1763/CD:2004) |
|
DIN IEC 62391-1 |
(DRAFT) Fixed electric double layer capacitors for use in electronic equipment - Part 1: Generic specification (IEC 40/1378/CD:2003) |
|
DIN IEC 62391-2 |
(DRAFT) Fixed electric double layer capacitors for use in electronic equipment - Part 2: Sectional specification: Electric double layer capacitors for power application (IEC 40/1379/CD:2003) |
|
DIN IEC 62391-2-1 |
(DRAFT) Fixed electric double layer capacitors for use in electronic equipment - Part 2-1: Blank detail specification: Electric double layer capacitors for power application; Assessment level EZ (IEC 40/1380/CD:2003) |
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DIN IEC 62421 |
(DRAFT) Electronic Modules - Generic standard (IEC 91/546/CD:2005) |
|
DIN IEC 62433 |
(DRAFT) Models of Integrated Circuits for EMI behavioural simulation (IEC 47A/726/CD:2005) |
|
DIN IEC 62449 |
(DRAFT) Connectors for electronic equipment - Product requirements - Detail specification for SCA-2 (Single Connector Attach-2) unshielded connectors (IEC 48B/1710/CD:2006) |
|
DIN IEC 62450 |
(DRAFT) Technical Specification for 40 pin SCA 2 connector with parallel selection (IEC 48B/1715/CD:2006) |
|
DIN IEC 62451 |
(DRAFT) HSSDC-2 Shielded Connectors (IEC 48B/1713/CD:2006) |
|
DIN IEC 62468 |
(DRAFT) The marking for presence and absence of the specified chemical substance in materials, components and mounted boards used in electrical and electronic equipment (IEC 91/612/CD:2006) |
|
DIN IEC 62496-1 |
(DRAFT) Optical circuit boards - Part 1: General standard (IEC 86/271/CD:2007) |
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DIN IEC 91/197/CD |
(DRAFT) Test 5E02: Surface insulation resistance, assemblies (IEC 91/197/CD:2000) |