DIN DIN IEC 60191-6-14 (DRAFT) Mechanical standardization of semiconductor devices - Part 6-14: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 47D/671/CD:2006)

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DIN DIN IEC 60191-6-14 Document Information:

Title
(DRAFT) Mechanical standardization of semiconductor devices - Part 6-14: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 47D/671/CD:2006)

(ENTWURF) Mechanische Normung von Halbleiterbauelementen - Teil 6-14: Allgemeine Regeln fuer die Erstellung von Gehaeusezeichnungen von SMD Halbleitergehaeusen - Messverfahren fuer Gehaeusemasse von kleinen Gehaeusen mit J-foermigen Anschluessen (SOJ) (IEC 47D/671/CD:2006)

Deutsches Institut Fur Normung E.V.

Publication Date:
Mar 1, 2007

Keywords:

Gehaeuse

Halbleiterbauelement

Normung

technische Zeichnung

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